Development of compression molding process for Fan-Out wafer level packaging by Julien, Bertheau, Fabrice F.C., Duval, Tadashi, Kubota, Pieter, Bex, Koen, Kennes, Alain, Phommahaxay, Arnita, Podpod, Eric, Beyne, Andy, Miller, Gerald, Beyer

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Reliability Study of Polymers Used in Sub-4-μm Pitch RDL Applications by Chery, Emmanuel, Duval, Fabrice F. C., Stucchi, Michele, Slabbekoorn, John, Croes, Kristof, Beyne, Eric

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3-D Wafer-Level Packaging Die Stacking Using Spin-on-Dielectric Polymer Liner Through-Silicon Vias by Civale, Y, Tezcan, D S, Philipsen, H G G, Duval, F F C, Jaenen, P, Travaly, Y, Soussan, P, Swinnen, B, Beyne, E

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Polymer Filling of Silicon Trenches for 3-D Through Silicon vias Applications by Duval, F F C, Okoro, C, Civale, Y, Soussan, P, Beyne, E

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Characterisation of PZT thin film micro-actuators using a silicon micro-force sensor by Duval, Fabrice F.C., Wilson, Stephen A., Ensell, Graham, Evanno, Nicolas M.P., Cain, Markys G., Whatmore, Roger W.

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Fabrication and modeling of high-frequency PZT composite thick film membrane resonators by DUVAL, Fabrice F. C, DOREY, Robert A, WRIGHT, Robert W, ZHAORONG HUANG, WHATMORE, Roger W

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Photosensitive polymer reliability for fine pitch RDL applications by Chery, Emmanuel, Duval, Fabrice F. C., Stucchi, Michele, Slabbekoorn, John, Croes, Kristof, Beyne, Eric

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