Search Results - Fang-Jun Leu

  • Showing 1 - 11 results of 11
Refine Results
  1. 1
    Investigation of pre-bending substrate design in packaging assembly of an IGBT power module

    Investigation of pre-bending substrate design in packaging assembly of an IGBT power module by Lee, Chang-Chun, Kao, Kuo-Shu, Lin, Leon, Chang, Jing-Yao, Leu, Fang-Jun, Lu, Yu-Lan, Chang, Tao-Chih

    Get full text
    Items that this one cites
    Items that cite this one
    Article
    Save to List
    Saved in:
  2. 2
    The first MIT 600 V/450 a IGBT module for EV/HEV applications

    The first MIT 600 V/450 a IGBT module for EV/HEV applications by Kuo-Shu Kao, Fang-Jun Leu, Jing-Yao Chang, Su-Yu Fan, Yu-Lan Lu, Tao-Chih Chang

    Request full text
    Conference Proceeding
    Save to List
    Saved in:
  3. 3
    Process feasibility of a novel dielectric material in a chip embedded, coreless and asymmetrically built-up structure

    Process feasibility of a novel dielectric material in a chip embedded, coreless and asymmetrically built-up structure by Yin-po Hung, Yu-wei Huang, Ren-shin Cheng, Fang-jun Leu, Su-Yu Fun, Yu-lan Lu, Tao-chih Chang

    Request full text
    Conference Proceeding
    Save to List
    Saved in:
  4. 4
    Wafer level chip stacked module by embedded IC packaging technology

    Wafer level chip stacked module by embedded IC packaging technology by Chien-Wei Chien, Li-Cheng Shen, Tao-Chih Chang, Chin-Yao Chang, Fang-Jun Leu, Tsung-Fu Yang, Cheng-Ta Ko, Ching-Kuan Lee, Chao-Kai Shu, Yuan-Chang Lee, Ying-Ching Shih

    Request full text
    Conference Proceeding
    Save to List
    Saved in:
  5. 5
    Reliable microjoints for chip stacking formed by solid-liquid interdiffusion (SLID) bonding

    Reliable microjoints for chip stacking formed by solid-liquid interdiffusion (SLID) bonding by Tao-Chih Chang, Ren-Shin Cheng, Kuo-Shu Kao, Wei Li, Ching-Kuan Lee, Jing-Yao Chang, Shin-Yi Huang, Chia-Wen Fan, Yin-Po Hung, Yu-Wei Huang, Yu-Min Lin, Tai-Hong Chen, Fang-Jun Leu, Su-Yu Fun, Wei-Chung Lo

    Request full text
    Conference Proceeding
    Save to List
    Saved in:
  6. 6
    Reliability assessment of the 20 um pitch micro-joints within a 3DIC assembly under various environments

    Reliability assessment of the 20 um pitch micro-joints within a 3DIC assembly under various environments by Shin-Yi Huang, Tao-Chih Chang, Ren-Shin Cheng, Jing-Yao Chang, Fang-Jun Leu, Yu-Lan Lu, Tsung-Fu Yang

    Request full text
    Conference Proceeding
    Save to List
    Saved in:
  7. 7
    Processing characteristics and reliability of embedded DDR2 memory chips

    Processing characteristics and reliability of embedded DDR2 memory chips by Yin-Po Hung, Tao-Chih Chang, Ching-Kuan Lee, Yuan-Chang Lee, Jing-Yao Chang, Shin-Yi Huang, Chao-Kai Hsu, Shu-Man Li, Jui-Hsiung Huang, Fang-Jun Leu, Ren-Shin Cheng, Yu-Wei Huang, Tai-Hong Chen

    Request full text
    Conference Proceeding
    Save to List
    Saved in:
  8. 8
    A scheme of array memory stacking to the multi-channel solid state disk (SSD) applications: High speed, high reliability, and green compliance

    A scheme of array memory stacking to the multi-channel solid state disk (SSD) applications: High speed, high reliability, and green compliance by Li-Cheng Shen, Wen-Chih Chen, Yin-Po Hung, Tsung-Fu Yang, Fang-Jim Leu, Tao-Chih Chang

    Request full text
    Conference Proceeding
    Save to List
    Saved in:
  9. 9
    Chip Embedded Wafer Level Packaging Technology for Stacked RF-SiP Application

    Chip Embedded Wafer Level Packaging Technology for Stacked RF-SiP Application by Chien-Wei Chien, Li-Cheng Shen, Tao-Chih Chang, Chin-Yao Chang, Fang-Jun Leu, Tsung-Fu Yang, Cheng-Ta Ko, Ching-Kuan Lee, Chao-Kai Shu, Yuan-Chang Lee, Ying-Ching Shih

    Request full text
    Items that cite this one
    Conference Proceeding
    Save to List
    Saved in:
  10. 10
    Development and characterization of low cost ultrathin 3D interconnect

    Development and characterization of low cost ultrathin 3D interconnect by Wei-Chung Lo, Yu-Hua Chen, Jeng-Dar Ko, Tzu-Ying Kuo, Chien-Wei Chien, Yu-Chih Chen, Wun-Yan Chen, Fang-Jun Leu, Hsu-Tien Hu

    Request full text
    Conference Proceeding
    Save to List
    Saved in:
  11. 11
    Thermal and Electrical Performance Enhancement with a Cost-Effective Packaging for High Speed Memory Chips

    Thermal and Electrical Performance Enhancement with a Cost-Effective Packaging for High Speed Memory Chips by Li-Cheng Shen, Chien-Wei Chien, Tao-Chih Chang, Tsung-Fu Yang, Wen-Chih Chen, Yin-Po Hung, Cheng-Ta Ko, Yuan-Chang Lee, Ying-Ching Shih, Wei, I., Lei, C.

    Request full text
    Conference Proceeding
    Save to List
    Saved in:

Search Tools: