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Search Results - Farrens, Shari N.
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Thin Wafer Handling Challenges and Emerging Solutions
by
Farrens, Shari N.
,
Bisson, Peter
,
Sood, Sumant
,
Hermanowski, James
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Chemical free room temperature wafer to wafer direct bonding
by
FARRENS, S. N
,
DEKKER, J. R
,
SMITH, J. K
,
ROBERDS, B. E
Published in
Journal of the Electrochemical Society
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Low‐Temperature Wafer Bonding of Surfaces Using a Reactive Sputtered Oxide
by
Folta, James A.
,
Hunt, Charles E.
,
Farrens, Shari N.
Published in
Journal of the Electrochemical Society
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Atmospheric Plasma Conditions Compatible with Wafer to Wafer Bonding Strategies
by
Farrens, Shari N.
,
Gabriel, Markus
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An atomic force microscopy study on the roughness of silicon wafers correlated with direct wafer bonding
by
ROBERDS, B. E
,
FARRENS, S. N
Published in
Journal of the Electrochemical Society
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The effects of process-induced defects on the chemical selectivity of highly doped boron etch stops in silicon
by
DESMOND, C. A
,
HUNT, C. E
,
FARRENS, S. N
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Journal of the Electrochemical Society
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