Description and evaluation of the FAST-Net smart pixel-based optical interconnection prototype by Haney, M.W., Kiamilev, F., Christensen, M.P., Milojkovic, P., Fokken, G.J., Vickberg, M., Gilbert, B.K., Rieve, J., Ekman, J., Chandramani, P.

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Emerging multigigahertz digital and mixed-signal integrated circuits targeted for military applications: dependence on advanced electronic packaging to achieve full performance by Gilbert, B.K., Degerstrom, M.J., Zabinski, P.J., Schafer, T.M., Fokken, G.J., Randall, B.A., Schwab, D.J., Daniel, E.S., Sommerfeldt, S.C.

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Corrections to "Description and evaluation of the fast-net smart pixel-based optical interconnection prototype" by Haney, M.W., Kiamilev, F., Christensen, M.P., Milojkovic, P., Fokken, G.J., Vickberg, M., Gilbert, B.K., Rieve, J., Ekman, J., Chandramani, P.

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Low-cost, multi-GHz electrical packaging for serial optoelectronic links utilizing vertical cavity surface emitting lasers by Fokken, G.J., Walters, W.L., Mattson, L.F., Gilbert, B.K.

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VCSEL electrical packaging analysis and design guidelines for multi-GHz applications by Hall, S.H., Walters, W.L., Mattson, L.F., Fokken, G.J., Gilbert, B.K.

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High-speed, low-power digital and analog circuits implemented in IBM SiGe BiCMOS technology by Fritz, K.E., Randall, B.A., Fokken, G.J., Walters, W.L., Lorsung, M.J., Nielsen, A.D., Prairie, J.F., Post, D.J., Greenberg, D.R., Gilbert, B.K.

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A chips-first multichip module implementation of passive and active test coupons utilizing Texas Instruments' high density interconnect technology by Schaefer, T.M., Kacines, J.J., Randall, B.A., Roszel, L.E., Fokken, G.J., Walter, D., Schwab, D.J., Mowatt, L., Gilbert, B.K.

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