Rapid thermal processing of silicon wafers with emissivity patterns by RABUS, M, FIORY, A. T, MANSFIELD, W, RAVINDRA, N. M, FRISELLA, P, AGARWAL, A, SORSCH, T, MINER, J, FERRY, E, KLEMENS, F, CIRELLI, R

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Education by Deeken, C, Ray, S, Zihni, A, Thompson, D, Gluckstein, J, Lake, S, Roll, S, Ndungu, B, Njihia, B, Saidi, H, Lorenz, R, Stechemesser, B, Reinpold, W, Dietz, U, Germer, C T, Winstanley, J, Miserez, M, Fitzgibbons, R, Schumpelick, V, de Beaux, A C, Zollinger, R, Matthews, B D, Baalman, S, Frisella, P, Bandyopadhyay, S, Raza, S, Manu, M, Okinyi, W, Macharia, M, Neema, O

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Education by Deeken, C., Ray, S., Zihni, A., Thompson, D., Gluckstein, J., Lake, S., Roll, S., Ndungu, B., Njihia, B., Saidi, H., Lorenz, R., Stechemesser, B., Reinpold, W., Dietz, U., Germer, C. T., Winstanley, J., Miserez, M., Fitzgibbons, R., Schumpelick, V., de Beaux, A. C., Zollinger, R., Matthews, B. D., Baalman, S., Frisella, P., Bandyopadhyay, S., Raza, S., Manu, M., Okinyi, W., Macharia, M., Neema, O.

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Laparoscopic Paraesophageal Hernia Repair, a Challenging Operation: Medium-Term Outcome of 116 Patients by Diaz, Sergio, Brunt, L.Michael, Klingensmith, Mary E, Frisella, Peggy M, Soper, Nathaniel J

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Education by Deeken, C., Ray, S., Zihni, A., Thompson, D., Gluckstein, J., Lake, S., Roll, S., Ndungu, B., Njihia, B., Saidi, H., Lorenz, R., Stechemesser, B., Reinpold, W., Dietz, U., Germer, C. T., Winstanley, J., Miserez, M., Fitzgibbons, R., Schumpelick, V., de Beaux, A. C., Zollinger, R., Matthews, B. D., Baalman, S., Frisella, P., Bandyopadhyay, S., Raza, S., Manu, M., Okinyi, W., Macharia, M., Neema, O.

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Education by Deeken, C, Ray, S, Zihni, A, Thompson, Jr, D, Gluckstein, J, Lake, S, Roll, S, Ndungu, B, Njihia, B, Saidi, H, Lorenz, R, Stechemesser, B, Reinpold, W, Dietz, U, Germer, C T, Winstanley, J, Miserez, M, Fitzgibbons, R, Schumpelick, V, de Beaux, A C, Zollinger, R, Matthews, B D, Baalman, S, Frisella, P, Bandyopadhyay, S, Raza, S, Manu, M, Okinyi, W, Macharia, M, Neema, O

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Education by Deeken, C, Ray, S, Zihni, A, Thompson, D, Gluckstein, J, Lake, S, Roll, S, Ndungu, B, Njihia, B, Saidi, H, Lorenz, R, Stechemesser, B, Reinpold, W, Dietz, U, Germer, C T, Winstanley, J, Miserez, M, Fitzgibbons, R, Schumpelick, V, de Beaux, A C, Zollinger, R, Matthews, B D, Baalman, S, Frisella, P, Bandyopadhyay, S, Raza, S, Manu, M, Okinyi, W, Macharia, M, Neema, O

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UV curing technology for advanced device fabrication: challenges and solutions by Waldfried, C., Sakthivel, P., Frisella, P., Moore, D., Berry, I., Durr, K., Qingyuan Han

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Improvement of within Wafer Uniformity of Device Parameters by Gradient Temperature Control with Bell Jar Hot Wall RTP by KyungWon Lee, Kim, S., Frisella, P., Jacobs, B., Cai, G., Reece, R., NohYeal Kwak, ChulYoung Ham, KwangChul Joo, DongHo Lee, SangWook Park, SungKi Park

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Ultra-shallow junctions and the effect of ramp-up rate during spike anneals in lamp-based and hot-walled RTP systems by Agarwal, A., Fiory, A.T., Gossmann, H.-J., Rafferty, C., Frisella, P., Hebb, J., Jackson, J.

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An eddy-correlation measurement of particulate deposition from the atmosphere by Wesely, M.L., Hicks, B.B., Dannevik, W.P., Frisella, S., Husar, R.B.

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