Search Results - Fryziel, Michel

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  1. 1
    Enhancement of bonding strength of packaging based on BCB bonding for RF devices

    Enhancement of bonding strength of packaging based on BCB bonding for RF devices by Seok, Seonho, Fryziel, Michel, Rolland, Nathalie, Rolland, Paul-Alain

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  2. 2
    W-Band RF-Mems Dicke Switch Networks in a Gaas MMIC Process

    W-Band RF-Mems Dicke Switch Networks in a Gaas MMIC Process by Reyaz, Shakila Bint, Samuelsson, Carl, Malmqvist, Robert, Seok, Seonho, Fryziel, Michel, Rolland, Paul-Alain, Grandchamp, Brice, Rantakari, Pekka, Vähä-Heikkilä, and Tauno

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  3. 3
    BCB Cap Packaging of MEMS Switches Integrated With 100-[Formula Omitted] MMIC Wafer

    BCB Cap Packaging of MEMS Switches Integrated With 100-[Formula Omitted] MMIC Wafer by Seok, Seonho, Kim, Janggil, Fryziel, Michel, Rolland, Nathalie, Grandchamp, Brice, Simon, Winfried, Baggen, Rens

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  4. 4
    Millimeter-wave broadband positioning system for indoor applications

    Millimeter-wave broadband positioning system for indoor applications by Bocquet, Michael, Loyez, Christophe, Fryziel, Michel, Rolland, Nathalie

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  5. 5
    BCB Cap Packaging of MEMS Switches Integrated With 100- \mu MMIC Wafer

    BCB Cap Packaging of MEMS Switches Integrated With 100- \mu MMIC Wafer by Seonho Seok, Janggil Kim, Fryziel, Michel, Rolland, Nathalie, Grandchamp, Brice, Simon, Winfried, Baggen, Rens

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  6. 6
    A GaAs MMIC Single-Chip RF-MEMS Switched Tunable LNA

    A GaAs MMIC Single-Chip RF-MEMS Switched Tunable LNA by Malmqvist, Robert, Samuelsson, Carl, Reyaz, Shakila, Gustafsson, Andreas, Seok, Seonho, Fryziel, Michel, Rolland, Paul-Alain, Grandchamp, Brice, Baggen, Rens

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  7. 7
    Wafer-level BCB CAP packaging of integrated MEMS switches with MMIC

    Wafer-level BCB CAP packaging of integrated MEMS switches with MMIC by Seok, Seonho, Kim, Janggil, Fryziel, Michel, Rolland, Nathalie, Rolland, Paul-alain, Maher, H., Simon, W., Baggen, R.

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  8. 8
    Vertical coaxial transitions for MM-waves 3D integration technologies

    Vertical coaxial transitions for MM-waves 3D integration technologies by Crunelle, Romain, Seonho Seok, Janggil Kim, Fryziel, Michel, Rolland, Nathalie, Cathelin, Andreia, Rolland, Paul-Alain

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