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Search Results - Funke, Hans-Juergen
Search Results - Funke, Hans-Juergen
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On the intermetallic corrosion of Cu-Al wire bonds
by
Boettcher, Tim
,
Rother, Michael
,
Liedtke, Stefan
,
Ullrich, Mandy
,
Bollmann, Marc
,
Pinkernelle, Andreas
,
Gruber, Daniel
,
Funke, Hans-Juergen
,
Kaiser, Michael
,
Kan Lee
,
Li, Martin
,
Leung, Karina
,
Li, Tina
,
Farrugia, Mark Luke
,
O'Halloran, Orla
,
Petzold, Matthias
,
März, Benjamin
,
Klengel, Robert
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Low Modulus Polyimide Coating on Wedge Bond to Improve Wire Bond Robustness in Thermal Cycling
by
Dong, Ou
,
Li, Zhiwen
,
Funke, Hans-Juergen
,
Fan, Haibo
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Optimization of Epoxy Molding Compound for Cu wire HTRB Robustness
by
Garete, April Joy
,
Li, Zhiwen
,
Bi, Billie Xianghong
,
Funke, Hans-Juergen
,
Lee, Kwong Cheung
,
Chen, Haibin
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Evaluation on Wedge Bond Performance of Different Cu Wire Types during Thermal Cycling Test (IMPACT 2020)
by
Bi, Billie Xianghong
,
Funke, Hans-Juergen
,
Lam, Wai
,
Chen, Haibin
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Conference Proceedings
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Subjects
Engineering
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Engineering, Electrical & Electronic
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Science & Technology
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Technology
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Molding Compounds
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Reliability
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Robustness
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Wire
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Wires
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Aluminum
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Copper
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Delamination
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Electromagnetic Compatibility
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Materials Science
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Materials Science, Multidisciplinary
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Materials Selection
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Optimization
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Thermal Cycling
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Thermal Cycling Tests
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Thermal Expansion
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Ieee Electronic Library (Iel) Conference Proceedings
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Ieee Xplore All Conference Series
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