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Stress-buffer and passivation processes for Si and GaAs IC's and passive components using photosensitive BCB: process technology and reliability data
by
Ganrou, P.E.
,
Rogers, W.B.
,
Scheck, D.M.
,
Strandjord, A.J.G.
,
Ida, Y.
,
Ohba, K.
Published in
IEEE transactions on advanced packaging
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Ieee Transactions On Advanced Packaging
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Applied Sciences
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Chips
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Design. Technologies. Operation Analysis. Testing
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Devices
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Dielectrics
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Electronics
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Electronics Industry
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Exact Sciences And Technology
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Gallium Arsenide
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Gallium Arsenides
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Integrated Circuits
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Masks
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Passivation
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Passive Components
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Plastic Packaging
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Polymer Films
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Protection
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Semiconductor Device Packaging
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Semiconductor Electronics. Microelectronics. Optoelectronics. Solid State Devices
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Semiconductors
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Ieee Electronic Library (Iel) Journals
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