Signal Integrity Analysis of High Speed Channel considering Thermal Distribution by Son, Keeyoung, Kim, Seongguk, Kim, Minsu, Lho, Daehwan, Kim, Keunwoo, Park, Hyunwook, Park, Gapyeol, Kim, Joungho

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Electrical Performance Analysis of Glass Interposer Channel and Power Distribution Network by Kim, Youngwoo, Cho, Kyungjun, Park, Gapyeol, Jeong, Seungtaek, Kim, Joungho

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Policy Gradient Reinforcement Learning-based Optimal Decoupling Capacitor Design Method for 2.5-D/3-D ICs using Transformer Network by Park, Hyunwook, Kim, Minsu, Kim, Subin, Jeong, Seungtaek, Kim, Seongguk, Kang, Hyungmin, Kim, Keunwoo, Son, Keeyoung, Park, Gapyeol, Son, Kyungjune, Shin, Taein, Kim, Joungho

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Signal Integrity and Power Leakage Optimization for 3D X-Point Memory Operation using Reinforcement Learning by Son, Kyungjune, Kim, Keunwoo, Park, Gapyeol, Lho, Daehwan, Park, Hyunwook, Sim, Boogyo, Shin, Taein, Park, Joonsang, Kim, Haeyeon, Kim, Joungho, Gong, Kyubong

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Signal Integrity Design and Analysis of a HDMI 2.1 Connector for Improved Electrical Characteristics by Park, Hyunwook, Park, Joonsang, Park, Gapyeol, Lho, Daehwan, Sim, Boogyo, Kang, Hyungmin, Shin, Taein, Kim, Seongguk, Choi, Seonguk, Choi, Seongmin, Kim, Jinyoung, Kim, Joungho

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Signal and power integrity (SI/PI) analysis of heterogeneous integration using embedded multi-die interconnect bridge (EMIB) technology for high bandwidth memory (HBM) by Kyungjun Cho, Youngwoo Kim, Hyunsuk Lee, Park, Gapyeol, Subin Kim, Kyungjune Son, Sumin Choi, Joungho Kim

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Processing-in-memory in High Bandwidth Memory (PIM-HBM) Architecture with Energy-efficient and Low Latency Channels for High Bandwidth System by Kim, Seongguk, Kim, Subin, Cho, Kyungjun, Shin, Taein, Park, Hyunwook, Lho, Daehwan, Park, Shinyoung, Son, Kyungjune, Park, Gapyeol, Kim, Joungho

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Design and Analysis of HDMI 2.1 Connector for Crosstalk Reduction using Tabs and Inverse Tabs by Lho, Daehwan, Park, Hyunwook, Park, Gapyeol, Park, Joonsang, Son, Kyungjune, Sim, Boogyo, Kang, Hyungmin, Kim, Seongguk, Shin, Taein, Kim, Keunwoo, Son, Keeyoung, Kim, Jinyoung, Kim, Joungho

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Design and Analysis of Thermal Transmission Line based Embedded Cooling Structures for High Bandwidth Memory Module and 2.5D/3D ICs by Son, Keeyoung, Kim, Subin, Park, Shinyoung, Park, Hyunwook, Kim, Keunwoo, Shin, Taein, Kim, Minsu, Son, Kyungjune, Park, Gapyeol, Jeong, Seungtaek, Kim, Joungho

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Design and Analysis of High-Definition Multimedia Interface Connectors considering Signal Integrity by Kumar, Gaurav, Park, Gapyeol, Park, Hyunwook, Lho, Daehwan, Park, Junyong, Kim, Joungho, Lee, Junho, Choi, Seongmin

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Bayesian Optimization of High-Speed Channel for Signal Integrity Analysis by Lho, Daehwan, Park, Junyong, Park, Hyunwook, Park, Shinyoung, Kim, Seongguk, Kang, Hyungmin, Kim, Subin, Park, Gapyeol, Son, Kyungjune, Kim, Joungho

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Design and Measurement of a HDMI 2.1 Connector for 8K TV considering Signal Integrity by Park, Gapyeol, Park, Hyunwook, Lho, Daehwan, Park, Junyong, Son, Kyungjune, Kim, Seongguk, Shin, Taein, Son, Keeyoung, Park, Joonsang, Kim, Joungho, Lee, Junho, Choi, Seongmin

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Impact of On-Chip Interconnection in a Large-Scale Memristor Crossbar Array for Neural Network Accelerator and Neuromorphic Chip by Shin, Taein, Son, Kyungjune, Kim, Seongguk, Cho, Kyungjun, Park, Shinyoung, Kim, Subin, Park, Gapyeol, Sim, Boogyo, Kim, Joungho

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Deep Reinforcement Learning-based Interconnection Design for 3D X-Point Array Structure Considering Signal Integrity by Son, Kyungjune, Kim, Minsu, Park, Hyunwook, Park, Shinyoung, Park, Gapyeol, Lho, Daewhan, Kim, Seoungguk, Shin, Taein, Son, Keeyoung, Kim, Keunwoo, Kim, Joungho

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Design and Analysis of a 10 Gbps USB 3.2 Gen 2 Type-C Connector for TV Set-Top Box by Son, Kyungjune, Choi, Sumin, Jung, Daniel Hyunsuk, Kim, Keunwoo, Park, Gapyeol, Lho, Daehwan, Park, Hyunwook, Park, Shinyoung, Kim, Joungho, Cho, Youngje, Park, Byungsoo, Choi, Seongmin

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Fast and Accurate Deep Neural Network (DNN) Model Extension Method for Signal Integrity (SI) Applications by Park, Hyunwook, Park, Junyong, Lho, Daehwan, Kim, Seongguk, Jeong, Seungtaek, Park, Gapyeol, Kim, Subin, Kang, Hyungmin, Sim, Boogyo, Son, Kyungjune, Shin, Taein, Kim, Joungho

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A Study on the High Frequency Performance of Solder ACFs Joints for Flex-on-Board Applications Using Coplanar Waveguide by Zhang, Shuye, Lin, Tiesong, He, Peng, Park, Junyong, Park, Gapyeol, Song, Huijin, Kim, Joungho, Paik, Kyung-Wook

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Design and Analysis of Receiver Channels of Glass Interposers for 5G Small Cell Front End Module by Park, Gapyeol, Kim, Joungho, Tummala, Rao, Kim, Youngwoo, Cho, Kyungjun, Park, Junyong, Watanabee, Atom, MarkondeyaRaj, Pulugurtha, Sundaram, Venky, Son, Kyungjune, Park, Hyunwook

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Modeling of Through-silicon Via (TSV) with an Embedded High-density Metal-insulator-metal (MIM) Capacitor by Cho, Kyungjun, Kim, Youngwoo, Kim, Subm, Park, Gapyeol, Son, Kyungjune, Park, Hyunwook, Kim, Seongguk, Choi, Sumin, Kim, Dong-Hyun, Kim, Joungho

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