Search Results - Gardopee, G.J.

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  1. 1
    Plasma thinning of silicon-on-insulator bonded wafers

    Plasma thinning of silicon-on-insulator bonded wafers by Gardopee, G.J., Mumola, P.B., Clapis, P.J., Zarowin, C.B., Bollinger, L.D., Ledger, A.M.

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  2. 2
    Plasma thinned SOI bonded wafers

    Plasma thinned SOI bonded wafers by Mumola, P.B., Gardopee, G.J., Clapis, P.J., Zarowin, C.B., Bollinger, L.D., Ledger, A.M.

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  3. 3
    Surface quality of plasma-thinned bonded SOI wafers

    Surface quality of plasma-thinned bonded SOI wafers by Feng, T., Matloubian, M., Gardopee, G.J., Mathur, D.P.

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    Plasma process integration for larger wafer manufacturing

    Plasma process integration for larger wafer manufacturing by Bollinger, L.D., Gardopee, G.J., Mathur, D.P., Mumola, P.B., Nester, J.F.

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    Material properties of plasma-thinned bonded SOI wafers

    Material properties of plasma-thinned bonded SOI wafers by Feng, T., Matloubian, M., Mathur, D.P., Mumola, P.B., Gardopee, G.J.

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