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Uncertainty evaluation of thickness and warp of a silicon wafer measured by a spectrally resolved interferometer
by
Drijarkara, Agustinus Praba
,
Gebrie, Tadesse Gergiso
,
Lee, Jae Yong
,
Kang, Chu-Shik
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Measurement science & technology
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Measurement Science & Technology
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Engineering
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Engineering, Multidisciplinary
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Instruments & Instrumentation
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Measurement Uncertainty
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Science & Technology
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Spectrally Resolved Interferometry
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Technology
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Thermo-Optic Coefficient
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Thickness
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Wafer
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Warp
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Institute Of Physics:jisc Collections:iop Publishing Journal Archive 1874-1998 (Access Period 2020 To 2024)
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Institute Of Physics:jisc Collections:iop Publishing Read And Publish 2024-2025 (Reading List)
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Institute Of Physics Iopscience Extra
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