Search Results - Geil, Bruce R

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  1. 1
    Validation of Infrared Camera Thermal Measurements on High-Voltage Power Electronic Components

    Validation of Infrared Camera Thermal Measurements on High-Voltage Power Electronic Components by Salem, T.E., Ibitayo, D., Geil, B.R.

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  2. 2
    Advanced operational techniques and pn-pn-pn structures for high-power silicon carbide gate turn-off thyristors

    Advanced operational techniques and pn-pn-pn structures for high-power silicon carbide gate turn-off thyristors by Shah, P.B., Geil, B.R., Ervin, M.E., Griffin, T.E., Bayne, S.B., Jones, K.A., Oldham, T.

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  3. 3
    Stereolithographically fabricated aluminum nitride microchannel substrates for integrated power electronics cooling

    Stereolithographically fabricated aluminum nitride microchannel substrates for integrated power electronics cooling by Jankowski, N.R., Everhart, L., Geil, B.R., Tipton, C.W., Chaney, J., Heil, T., Zimbeck, W.

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  4. 4
    A Technique for Die Surface Temperature Measurement of High-Voltage Power Electronic Components using Coated Thermocouple Probes

    A Technique for Die Surface Temperature Measurement of High-Voltage Power Electronic Components using Coated Thermocouple Probes by Salem, T.E., Ibitayo, D., Geil, B.R.

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  5. 5
    Reliability Assessment of Lead-Free Universal Solder for Direct Bonding in Power Electronics Packaging

    Reliability Assessment of Lead-Free Universal Solder for Direct Bonding in Power Electronics Packaging by Ibitayo, D., Everhart, L., Morgenstern, M., Geil, B.R., Mitchell, J.W.

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  6. 6
    Preliminary Study of Electronic Replacement Compasses for the Army

    Preliminary Study of Electronic Replacement Compasses for the Army by Geil,Bruce R

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  7. 7
    Preliminary Study of Electronic Replacement Compasses for the Army

    Preliminary Study of Electronic Replacement Compasses for the Army by Geil, Bruce R

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  8. 8
    High Temperature Packaging and Pulse Testing of Parallel SiC Thyristors

    High Temperature Packaging and Pulse Testing of Parallel SiC Thyristors by Geil, Bruce R, Bayne, Stephen B, O'Brien, Heather

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  9. 9
    A High-Temperature Printed Circuit Board

    A High-Temperature Printed Circuit Board by Geil, Bruce R, DeLancey, Merle W

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  10. 10
    Double-Sided Wafer Alignment Techniques

    Double-Sided Wafer Alignment Techniques by Mermagen, Timothy J, Geil, Bruce R

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  11. 11
    North American Climate in CMIP5 Experiments: Part III: Assessment of Twenty-First-Century Projections

    North American Climate in CMIP5 Experiments: Part III: Assessment of Twenty-First-Century Projections by Maloney, Eric D., Camargo, Suzana J., Chang, Edmund, Colle, Brian, Fu, Rong, Geil, Kerrie L., Hu, Qi, Jiang, Xianan, Johnson, Nathaniel, Karnauskas, Kristopher B., Kinter, James, Kirtman, Benjamin, Kumar, Sanjiv, Langenbrunner, Baird, Lombardo, Kelly, Long, Lindsey N., Mariotti, Annarita, Meyerson, Joyce E., Mo, Kingtse C., Neelin, J. David, Pan, Zaitao, Seager, Richard, Serra, Yolande, Seth, Anji, Sheffield, Justin, Stroeve, Julienne, Thibeault, Jeanne, Xie, Shang-Ping, Wang, Chunzai, Wyman, Bruce, Zhao, Ming

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  12. 12
    Comparing Microchannel Technologies to Minimize the Thermal Stack and Improve Thermal Performance in Hybrid Electric Vehicles

    Comparing Microchannel Technologies to Minimize the Thermal Stack and Improve Thermal Performance in Hybrid Electric Vehicles by Jankowski, N.R., Everhart, L., Morgan, B., Geil, B., McCluskey, P.

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