Search Results - Gilheyun Choi

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  1. 1
    An effective procedure for sensor variable selection and utilization in plasma etching for semiconductor manufacturing

    An effective procedure for sensor variable selection and utilization in plasma etching for semiconductor manufacturing by Baek, Kye Hyun, Edgar, Thomas F., Song, Kiwook, Choi, Gilheyun, Cho, Han Ku, Han, Chonghun

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  2. 2
    Implementation of a robust virtual metrology for plasma etching through effective variable selection and recursive update technology

    Implementation of a robust virtual metrology for plasma etching through effective variable selection and recursive update technology by Hyun Baek, Kye, Song, Kiwook, Han, Chonghun, Choi, Gilheyun, Ku Cho, Han, Edgar, Thomas F.

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  3. 3
    Properties of isolation liner and electrical characteristics of high aspect ratio TSV in 3D stacking technology

    Properties of isolation liner and electrical characteristics of high aspect ratio TSV in 3D stacking technology by DeokYoung Jung, Kwang-Jin Moon, Byung-Lyul Park, Gilheyun Choi, Ho-Kyu Kang, Chilhee Chung, Deok Young Jung, Yonghan Rho

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  4. 4
    Multiple input multiple output controller design to match chamber performance in plasma etching for semiconductor manufacturing

    Multiple input multiple output controller design to match chamber performance in plasma etching for semiconductor manufacturing by Hyun Baek, Kye, P. Han, Kyounghoon, Choi, Gilheyun, Kang, Ho-Kyu, Seung Jung, Eun, Song, Kiwook, Han, Chonghun, Edgar, Thomas F.

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  5. 5
    Annealing process and structural considerations in controlling extrusion-type defects Cu TSV

    Annealing process and structural considerations in controlling extrusion-type defects Cu TSV by Jinho An, Kwang-Jin Moon, Soyoung Lee, Do-Sun Lee, Kiyoung Yun, Byung-Lyul Park, Ho-Jun Lee, Jiwoong Sue, Yeong-Lyeol Park, Gilheyun Choi, Ho-Kyu Kang, Chilhee Chung

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  6. 6
    Successful recovery of moisture-induced TDDB degradation for Cu/ULK(k=2.5) BEOL interconnect

    Successful recovery of moisture-induced TDDB degradation for Cu/ULK(k=2.5) BEOL interconnect by Sang Hoon Ahn, Tae-Soo Kim, Viet Ha Nguyen, OkHee Park, KyuHee Han, Jang-Hee Lee, JongMyeong Lee, Gilheyun Choi, Ho-Kyu Kang, Chilhee Chung

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