Search Results - Golim, Obert

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  1. 1
    Achieving low-temperature wafer level bonding with Cu-Sn-In ternary at 150 °C

    Achieving low-temperature wafer level bonding with Cu-Sn-In ternary at 150 °C by Golim, Obert, Vuorinen, Vesa, Ross, Glenn, Wernicke, Tobias, Pawlak, Marta, Tiwary, Nikhilendu, Paulasto-Kröckel, Mervi

    Published in Scripta materialia
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  2. 2
    Low-Temperature Wafer-Level Bonding with Cu-Sn-In Solid Liquid Interdiffusion for Microsystem Packaging

    Low-Temperature Wafer-Level Bonding with Cu-Sn-In Solid Liquid Interdiffusion for Microsystem Packaging by Golim, Obert, Vuorinen, Vesa, Wernicke, Tobias, Pawlak, Marta, Paulasto-Kröckel, Mervi

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  3. 3
    Investigative characterization of delamination at TiW-Cu interface in low-temperature bonded interconnects

    Investigative characterization of delamination at TiW-Cu interface in low-temperature bonded interconnects by Golim, Obert, Vuorinen, Vesa, Ross, Glenn, Suihkonen, Sami, Paulasto-Kröckel, Mervi

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  4. 4
    Synthesis, neutron diffraction and photoluminescence properties of a whitlockite structured Ca9MgLi(PO4)7:Pr3+ phosphor

    Synthesis, neutron diffraction and photoluminescence properties of a whitlockite structured Ca9MgLi(PO4)7:Pr3+ phosphor by Golim, Obert P., Huang, Saifang, Yin, Li, Yang, Tingxuan, Zhou, Huihua, Gao, Wei, Söhnel, Tilo, Cao, Peng

    Published in Ceramics international
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  5. 5
    Greenish-yellow emitting Ca9MgLi(PO4)7:Dy3+ phosphors – Photoluminescence and thermal stability

    Greenish-yellow emitting Ca9MgLi(PO4)7:Dy3+ phosphors – Photoluminescence and thermal stability by Golim, Obert P., Huang, Saifang, Yang, Tingxuan, Yin, Li, Zhang, Kelly Sipei, Gao, Wei, Cao, Peng

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