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Development of high copper concentration, low operating temperature, and environmentally friendly electroless copper plating using a copper ‐ glycerin complex solution
by
Huang, J.H.
,
Shih, P.S.
,
Renganathan, V.
,
Grӓfner, S.J.
,
Chen, Y.A.
,
Huang, C.H.
,
Kao, C.L.
,
Lin, Y.S.
,
Hung, Y.C.
,
Kao, C.R.
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Electrochimica acta
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Electrochimica Acta
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Bath Parameters
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Copper‐Glycerin Complex Solution
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Electrochemistry
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Electroless Plating
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Optimization
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