Three-Dimensional Dynamic Random Access Memories Using Through-Silicon-Vias by Kirihata, Toshiaki, Golz, John, Wordeman, Matthew, Batra, Pooja, Maier, Gary W., Robson, Norman, Graves-abe, Troy L., Berger, Daniel, Iyer, Subramanian S.

Get full text

Three-Dimensional Wafer Stacking Using Cu TSV Integrated with 45 nm High Performance SOI-CMOS Embedded DRAM Technology by Batra, Pooja, Skordas, Spyridon, LaTulipe, Douglas, Winstel, Kevin, Kothandaraman, Chandrasekharan, Himmel, Ben, Maier, Gary, He, Bishan, Gamage, Deepal Wehella, Golz, John

Get full text

Prototype of multi-stacked memory wafers using low-temperature oxide bonding and ultra-fine-dimension copper through-silicon via interconnects by Wei Lin, Faltermeier, Johnathan, Winstel, Kevin, Skordas, Spyridon, Graves-Abe, Troy, Batra, Pooja, Herman, Kenneth, Golz, John, Kirihata, Toshiaki, Garant, John, Hubbard, Alex, Cauffman, Kris, Levine, Theodore, Kelly, James, Priyadarshini, Deepika, Peethala, Brown, Patlolla, Raghuveer, Shoudy, Matthew, Demarest, James J., Wynne, Jean, Canaperi, Donald, McHerron, Dale, Berger, Dan, Iyer, Subramanian

Request full text

Programmable organic thin-film devices with extremely high current densities by Graves-Abe, Troy, Sturm, J. C.

Get full text

Bonding technologies for chip level and wafer level 3D integration by Sakuma, Katsuyuki, Skordas, Spyridon, Zitz, Jeffrey, Perfecto, Eric, Guthrie, William, Guerin, Luc, Langlois, Richard, Liu, Hsichang, Ramachandran, Koushik, Lin, Wei, Winstel, Kevin, Kohara, Sayuri, Sueoka, Kuniaki, Angyal, Matthew, Graves-Abe, Troy, Berger, Daniel, Knickerbocker, John, Iyer, Subramanian

Request full text

Self-Aligned, Insulating-Layer Structure for Integrated Fabrication of Organic Self-Assembled Multilayer Electronic Devices by Graves-Abe, Troy, Bao, Zhenan, Sturm, J. C

Get full text

Solvent-enhanced dye diffusion in polymer thin films for polymer light-emitting diode application by Graves-Abe, Troy, Pschenitzka, Florian, Jin, H. Z., Bollman, Brent, Sturm, J. C., Register, R. A.

Get full text

Dynamics of write and erase mechanisms in a novel organic memory with extremely low ON resistance by Graves-Abe, T., Stunn, J.C.

Request full text

Three-dimensional wafer stacking using Cu TSV integrated with 45nm high performance SOI-CMOS embedded DRAM technology by Batra, Pooja, LaTulipe, Douglas, Skordas, Spyridon, Winstel, Kevin, Kothandaraman, Chandrasekharan, Himmel, Ben, Maier, Gary, He, Bishan, Gamage, Deepal Wehella, Golz, John, Wei Lin, Tuan Vo, Priyadarshini, Deepika, Hubbard, Alex, Cauffman, Kristian, Peethala, Brown, Barth, John, Kirihata, Toshiaki, Graves-Abe, Troy, Robson, Norman, Iyer, Subramanian

Request full text