Search Results - Greenslit, Daniel

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  1. 1
    Atomic layer deposition growth of a novel mixed-phase barrier for seedless copper electroplating applications

    Atomic layer deposition growth of a novel mixed-phase barrier for seedless copper electroplating applications by Kumar, Sumit, Greenslit, Daniel, Chakraborty, Tonmoy, Eisenbraun, Eric T.

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  2. 2
    Nucleation and growth characteristics of electroplated Cu on plasma enhanced atomic layer deposition-grown RuTaN direct plate barriers

    Nucleation and growth characteristics of electroplated Cu on plasma enhanced atomic layer deposition-grown RuTaN direct plate barriers by Chakraborty, Tonmoy, Greenslit, Daniel, Eisenbraun, Eric T.

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  3. 3
    Characterization of Ultrathin PEALD-Grown RuCo Films for Diffusion Barrier and Copper Direct-Plate Applications

    Characterization of Ultrathin PEALD-Grown RuCo Films for Diffusion Barrier and Copper Direct-Plate Applications by Greenslit, Daniel V., Eisenbraun, Eric

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  4. 4
    Early Testable Addressable Logic (ETAL) Test Structure: Showcasing the use of an Alternate Logic Yield Learning Test Structure for Technology Development

    Early Testable Addressable Logic (ETAL) Test Structure: Showcasing the use of an Alternate Logic Yield Learning Test Structure for Technology Development by Ahsan, Ishtiaq, Khan, Shahrukh, Winkler, Joerg, Sekar, Kannan, Bawaskar, Neerja, Crown, Steve, Zhang, Kan, O'tool, Martin, Lin, Teng-Yin, Lagus, Mark, Sohn, D.K., Greenslit, Daniel, Evans, Bill, Laaksonen, Toni, Gordon, Tarl, Song, Zhigang, Liu, Yandong, Masnik, John, Barth, Frank

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  5. 5
    Development of Manufacturable Solutions for the Direct Plating of Copper on Robust ALD-Grown Barriers

    Development of Manufacturable Solutions for the Direct Plating of Copper on Robust ALD-Grown Barriers by Kumar, Sumit, Greenslit, Daniel, Eisenbraun, Eric

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  6. 6
    Invetigations of Ultrathin Ru-WCN Mixed Phase Films for Diffusion Barrier and Copper Direct-Plate Applications

    Invetigations of Ultrathin Ru-WCN Mixed Phase Films for Diffusion Barrier and Copper Direct-Plate Applications by Greenslit, Daniel V., Kumar, Sumit, Chakraborty, Tonmoy, Eisenbraun, Eric

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