Search Results - Guinn, KV

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  1. 1
    Chemical topography of anisotropic etching of polycrystalline Si masked with photoresist

    Chemical topography of anisotropic etching of polycrystalline Si masked with photoresist by Guinn, K. V., Donnelly, V. M.

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  2. 2
    Laser-induced thermal desorption as an in situ surface probe during plasma processing

    Laser-induced thermal desorption as an in situ surface probe during plasma processing by Herman, IP, Donnelly, VM, Guinn, KV, Cheng, CC

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  3. 3
    Thermal desorption over wide pressure ranges applied to characterization of equilibrium adsorption of CO over Pt

    Thermal desorption over wide pressure ranges applied to characterization of equilibrium adsorption of CO over Pt by Guinn, Keith V., Rhoades, Deanna S., Herz, Richard K.

    Published in Surface science
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  4. 4
    Decomposition of hexafluoroacetylacetonate Cu(I) vinyltrimethylsilane on, and diffusion of Cu into single crystal and polycrystalline titanium nitride

    Decomposition of hexafluoroacetylacetonate Cu(I) vinyltrimethylsilane on, and diffusion of Cu into single crystal and polycrystalline titanium nitride by Guinn, K.V., Donnelly, V.M., Gross, M.E., Baiocchi, F.A., Petrov, I., Greene, J.E.

    Published in Surface science
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  5. 5
    Surface chemistry during plasma etching of silicon

    Surface chemistry during plasma etching of silicon by Donnelly, Vincent M., Herman, I. P., Cheng, C. C., Guinn, K. V.

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  6. 6
    Surface analysis during plasma etching by laser-induced thermal desorption

    Surface analysis during plasma etching by laser-induced thermal desorption by HERMAN, I. P, DONNELLY, V. M, CHENG, C.-C, GUINN, K. V

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  7. 7
    Thermal desorption in the pressure gap and at high pressure using a Micro Knudsen Effusion Cell

    Thermal desorption in the pressure gap and at high pressure using a Micro Knudsen Effusion Cell by GUINN, K. V, HERZ, R. K

    Published in Catalysis letters
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  8. 8
    Flip-chip and chip-scale I/O density requirements and printed wiring board capabilities

    Flip-chip and chip-scale I/O density requirements and printed wiring board capabilities by Guinn, K.V., Frye, R.C.

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    Conference Proceeding
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  9. 9
    RF flip-module BGA package

    RF flip-module BGA package by Low, Y.L., Degani, Y., Guinn, K.V., Dudderrar, T.D., Gregus, J., Frye, R.C.

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  10. 10
    RF flip-module BGA package

    RF flip-module BGA package by Low, Y.L., Degani, Y., Guinn, K.V., Dudderrar, T.D., Gregus, J.A., Frye, R.C.

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