Search Results - Gwang Pyuk Suh

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    Alleviating electromigration through re-engineering the interface between Cu & dielectric-diffusion-barrier in 90 nm Cu/SiOC (k=2.9) device

    Alleviating electromigration through re-engineering the interface between Cu & dielectric-diffusion-barrier in 90 nm Cu/SiOC (k=2.9) device by Young Jin Wee, Soo Geun Lee, Won Sang Song, Kyoung-Woo Lee, Nam Hyung Lee, Ja Eung Ku, Ki-Kwan Park, Seung Jin Lee, Jae Hak Kim, Joo Hyuk Chung, Hong Jae Shin, Sang Rok Hah, Ho-Kyu Kang, Gwang Pyuk Suh

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