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New insight into stress induced voiding mechanism in Cu interconnects
by
Sun-Jung Lee
,
Soo-Geun Lee
,
Bong-Suk Suh
,
Hongjae Shin
,
Nae-In Lee
,
Ho-Kyu Kang
,
Gwangpyuk Suh
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Copper
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Dielectrics
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Engineering
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Failure Analysis
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Grain Boundaries
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