Damage free integration of ultralow-k dielectrics by template replacement approach by Zhang, L., de Marneffe, J.-F., Heylen, N., Murdoch, G., Tokei, Z., Boemmels, J., De Gendt, S., Baklanov, M. R.

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Backside Power Delivery With Relaxed Overlay for Backside Patterning Using Extreme Wafer Thinning and Molybdenum-Filled Slit Nano Through Silicon Vias by Zhao, P., Witters, L., Jourdain, A., Stucchi, M., Jourdan, N., Maes, J. W., Bana, H., Zhu, C., Chukka, R., Sebaai, F., Vandersmissen, K., Heylen, N., Montero, D., Wang, S., D'Have, K., Schleicher, F., Vos, J. De, Beyer, G., Miller, A., Beyne, E.

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3-D Sequential Stacked Planar Devices Featuring Low-Temperature Replacement Metal Gate Junctionless Top Devices With Improved Reliability by Vandooren, A., Franco, J., Parvais, B., Wu, Z., Witters, L., Walke, A., Li, W., Peng, L., Deshpande, V., Bufler, F. M., Rassoul, N., Hellings, G., Jamieson, G., Inoue, F., Verbinnen, G., Devriendt, K., Teugels, L., Heylen, N., Vecchio, E., Zheng, T., Rosseel, E., Vanherle, W., Hikavyy, A., Chan, B. T., Ritzenthaler, R., Besnard, G., Schwarzenbach, W., Gaudin, G., Radu, I., Nguyen, B.-Y., Waldron, N., De Heyn, V., Mocuta, D., Collaert, N.

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Geometry Effect on Impurity Incorporation and Grain Growth in Narrow Copper Lines by Zhang, W., Brongersma, S. H., Heylen, N., Beyer, G., Vandervorst, W., Maex, K.

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P15-22 Particle-induced systemic autoimmune features in C57BL/6J and NOD/ShiLtJ mice by Lemaire, F., Janssen, L., Marain, N., Heylen, N., Koshy, P., Vanstapel, A., Ronsmans, S., Ghosh, M., Hoet, P.

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Barrier and seed repair performance of thin RuTa films for Cu interconnects by Volders, H., Carbonell, L., Heylen, N., Kellens, K., Zhao, C., Marrant, K., Faelens, G., Conard, T., Parmentier, B., Steenbergen, J., Peer, M. Van de, Wilson, C.J., Sleeckx, E., Beyer, G.P., Tőkei, Zs, Gravey, V., Shah, K., Cockburn, A.

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Surface properties restoration and passivation of high porosity ultra low- k dielectric ( k ∼ 2.3) after direct-CMP by Sinapi, F., Heylen, N., Travaly, Y., Vereecke, G., Baklanov, M., Kesters, E., Van Hoeymissen, J., Hernandèz, J.L., Beyer, G., Fischer, P.

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Backside Power Delivery with relaxed overlay for backside patterning using extreme wafer thinning and Molybdenum-filled slit nano Through Silicon Vias by Zhao, P., Witters, L., Jourdain, A., Stucchi, M., Jourdan, N., Maes, J.W., Bana, H., Zhu, C., Chukka, R., Sebaai, F., Vandersmissen, K., Heylen, N., Montero, D., Wang, S., D'Have, K., Schleicher, F., De Vos, J., Beyer, G., Miller, A., Beyne, E.

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In-line Small-Spot X-Ray Fluorescence Assessment of Electroplating and Chemical Mechanical Polishing by Gueneau de Mussy, J.-P., Bottiglieri, G., Heylen, N., Carbonell, L., O’Dell, J., Agnihotri, D. K., Tokar, A., Mazor, I.

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Buried Power Rail Metal exploration towards the 1 nm Node by Gupta, A., Radisic, D., Maes, J. W., Pedreira, O. Varela, Soulie, J-P., Jourdan, N., Mertens, H., Bandyopadhyay, S., Le, Q. T., Pacco, A., Heylen, N., Vandersmissen, K., Devriendt, K., Zhu, C., Datta, S., Sebaai, F., Wang, S., Mousa, M., Lee, J., Geypen, J., De Wachter, B., Chehab, B., Salahuddin, S. M., Murdoch, G., Biesemans, S., Tokei, Zs, Litta, E. Dentoni, Horiguchi, N.

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Low temperature source/drain epitaxy and functional silicides: essentials for ultimate contact scaling by Porret, C., Everaert, J.-L., Schaekers, M., Ragnarsson, L.-A., Hikavyy, A., Rosseel, E., Rengo, G., Loo, R., Khazaka, R., Givens, M., Piao, X., Mertens, S., Heylen, N., Mertens, H., De Carvalho Cavalcante, C. Toledo, Sterckx, G., Brus, S., Mehta, A. Nalin, Korytov, M., Batuk, D., Favia, P., Langer, R., Pourtois, G., Swerts, J., Litta, E. Dentoni, Horiguchi, N.

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Impact of thinning and through silicon via proximity on High-k / Metal Gate first CMOS performance by Mercha, A, Redolfi, A, Stucchi, M, Minas, N, Van Olmen, J, Thangaraju, S, Velenis, D, Domae, S, Yang, Y, Katti, G, Labie, R, Okoro, C, Zhao, M, Asimakopoulos, P, De Wolf, I, Chiarella, T, Schram, T, Rohr, E, Van Ammel, A, Jourdain, A, Ruythooren, W, Armini, S, Radisic, A, Philipsen, H, Heylen, N, Kostermans, M, Jaenen, P, Sleeckx, E, Sabuncuoglu Tezcan, D, Debusschere, I, Soussan, P, Perry, D, Van der Plas, G, Cho, J H, Marchal, P, Travaly, Y, Beyne, E, Biesemans, S, Swinnen, B

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Inflection points in interconnect research and trends for 2nm and beyond in order to solve the RC bottleneck by Tokei, Zs, Vega, V., Murdoch, G., O'Toole, M., Croes, K., Baert, R., Veen, M. Van der, Adelmann, C., Soulie, J. P., Boemmels, J., Wilson, C., Park, S. H., Sankaran, K., Pourtois, G., Sweerts, J., Paolillo, S., Decoster, S., Mao, M., Lazzarino, F., Versluijs, J., Blanco, V., Ercken, M., Kesters, E., Le, Q-T., Holsteyns, F., Heylen, N., Teugels, L., Devriendt, K., Struyf, H., Morin, P., Jourdan, N., Elshocht, S. Van, Ciofi, I., Gupta, A., Zahedmanesh, H., Vanstreels, K., Na, M. H.

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Buried Power Rail Scaling and Metal Assessment for the 3 nm Node and Beyond by Gupta, A., Pedreira, O. Varela, Tao, Z., Mertens, H., Radisic, D., Jourdan, N., Devriendt, K., Heylen, N., Wang, S., Chehab, B., Jang, D., Hellings, G., Sebaai, F., Lorant, C., Teugels, L., Peter, A., Chan, BT, Schleicher, F., Demonie, I., Marien, P., Sepulveda, A., Richard, O., Nagesh, N., Lesniewska, A., Lazzarino, F., Ryckaert, J., Morin, P., Altamirano-Sanchez, E., Murdoch, G., Bommels, J., Demuynck, S., Na, M. H, Tokei, Z., Biesemans, S., Litta, E. Dentoni, Horiguchi, N.

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Barrier/liner stacks for scaling the Cu interconnect metallization by van der Veen, Marleen H., Jourdan, N., Gonzalez, V. Vega, Wilson, C. J., Heylen, N., Pedreira, O. Varela, Struyf, H., Croes, K., Bommels, J., Tokei, Zs

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Exploring W-Cu hybrid dual damascene metallization for future nodes by van der Veen, Marleen H., Pedreira, O. Varela, Heylen, N., Jourdan, N., Lariviere, S., Park, S., Struyf, H., Tokei, Zs, Lei, W., Pethe, S., Hwang, S., Chen, F., Wu, Z., Machillot, J., Cockburn, A., Jansen, A.

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90nm W\Al2O3\TiW\Cu 1T1R CBRAM cell showing low-power, fast and disturb-free operation by Belmonte, A., Kim, W., Chan, Bt, Heylen, N., Fantini, A., Houssa, M., Jurczak, M., Goux, L.

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Process Integration of High Aspect Ratio Vias with a Comparison between Co and Ru Metallizations by Vega-Gonzalez, V., Montero, D., Versluijs, J., Pedreira, O. Varela, Jourdan, N., Puliyalil, H., Chehab, B., Peissker, T., Haider, A., Batuk, D., Martinez, G. T., Geypen, J., Le, Q. T., Bazzazian, N., Heylen, N., van der Veen, M., El-Mekki, Z., Webers, T., Vats, H., Rynders, L., Cupak, M., Uk-Lee, J., Drissi, Y., Halipre, L., Gillijns, W., Charley, A.-L., Verdonck, P., Witters, T., Gompel, S. V., Kimura, Y., Ciofi, I., De Wachter, B., Swerts, J., Grieten, E., Ercken, M., Kim, R., Croes, K., Leray, P., Jaysankar, M., Nagesh, N., Ramakers, L., Murdoch, G., Park, S., Tokei, Z., Dentoni-Litta, E., Horiguchi, N.

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Three-Layer BEOL Process Integration with Supervia and Self-Aligned-Block Options for the 3 nm Node by Vega-Gonzalez, V., Bekaert, J., Kesters, E., Le, Q. T., Lorant, C., Varela P., O., Teugels, L., Heylen, N., El-Mekki, Z., van der Veen, M., Webers, T., Wilson, C. J., Vats, H., Rynders, L., Cupak, M., Uk-Lee, J., Drissi, Y., Halipre, L., Charley, A.-L., Verdonck, P., Witters, T., Gompel, S. V., Briggs, B., Kimura, Y., Jourdan, N., Ciofi, I., Gupta, A., Contino, A., Boccardi, G., Lariviere, S., Dupas, L., De-Wachter, B., Vancoille, E., Decoster, S., Lazzarino, F., Ercken, M, Debacker, P., Kim, R., Trivkovic, D., Croes, K., Leray, P., Dillemans, L., Chen, Y.-F., Tokei, Z., Versluijs, J., Lesniewska, A., Paolillo, S., Baert, R., Puliyalil, H.

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Effect of MRC-5 fibroblast conditioned medium on breast cancer cell motility and invasion in vitro by Heylen, N, Baurain, R, Remacle, C, Trouet, A

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