Search Results - Hall, Gavin D.R.

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  1. 1
    Studies of Bias Temperature Instabilities in 4H-SiC DMOSFETs

    Studies of Bias Temperature Instabilities in 4H-SiC DMOSFETs by Ghosh, Amartya, Hao, Jifa, Cook, Michael, Kendrick, Chris, Suliman, Samia A., Hall, Gavin D.R., Kopley, Tom, Awadelkarim, Osama O.

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  2. 2
    Dielectric Relaxation, Aging and Recovery in High-K MIM Capacitors

    Dielectric Relaxation, Aging and Recovery in High-K MIM Capacitors by Holden, Konner E. K., Hall, Gavin D. R., Cook, Michael, Kendrick, Chris, Pabst, Kaitlyn, Greenwood, Bruce, Daugherty, Robin, Gambino, Jeff P., Allman, Derryl D. J.

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  3. 3
    Interactions and self-healing of Cu vias during stress migration tests and implications for burn-in and design rule formulations

    Interactions and self-healing of Cu vias during stress migration tests and implications for burn-in and design rule formulations by Hall, Gavin D. R., Allman, Derryl D. J.

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  4. 4
    Highly-accelerated WLR learning cycles for development of a trench MOSFET: Method and case study

    Highly-accelerated WLR learning cycles for development of a trench MOSFET: Method and case study by Moore, Darren, Hall, Gavin D. R., Suzuki, Masaru, Burke, Peter

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  5. 5
    An evaluation of accelerated failure time models of stress-migration and stress-induced voiding failures under vias

    An evaluation of accelerated failure time models of stress-migration and stress-induced voiding failures under vias by Hall, Gavin D. R., Allman, Derryl D. J.

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  6. 6
    Engineering the failure-free lifetime for Cu vias

    Engineering the failure-free lifetime for Cu vias by Hall, Gavin D. R., Allman, Derryl D. J., Eda, Masaichi, Long, Thomas F.

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  7. 7
    On the distribution of stress-induced voiding failures under vias

    On the distribution of stress-induced voiding failures under vias by Hall, Gavin D. R., Allman, Derryl D. J.

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  8. 8
    Unified model of fractal conductance fluctuations for diffusive and ballistic semiconductor devices

    Unified model of fractal conductance fluctuations for diffusive and ballistic semiconductor devices by Marlow, C. A., Taylor, R. P., Martin, T. P., Scannell, B. C., Linke, H., Fairbanks, M. S., Hall, G. D. R., Shorubalko, I., Samuelson, L., Fromhold, T. M., Brown, C. V., Hackens, B., Faniel, S., Gustin, C., Bayot, V., Wallart, X., Bollaert, S., Cappy, A.

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  9. 9
    Reliability evaluations of ECP tools and chemistries

    Reliability evaluations of ECP tools and chemistries by Hall, G. D. R., Allman, D. D. J., Piatt, G., Hulse, P. T.

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  10. 10
    Impact of via interactions and metal slotting on stress induced voiding

    Impact of via interactions and metal slotting on stress induced voiding by Hall, G.D.R., Allman, D.D.J., Bhatt, H.D.

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  11. 11
    A quality-cost model of in-line inspections for excursion detection and reduction

    A quality-cost model of in-line inspections for excursion detection and reduction by Hall, G.D.R., Young, R., Dunne, M., Muro, M.

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  12. 12
    Stress Migration Modeling Using Probabilistic Physics of Failure

    Stress Migration Modeling Using Probabilistic Physics of Failure by Hall, Gavin D. R., Allman, Derryl D. J.

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