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Zeta potential-tunable silica abrasives and fluorinated surfactants in chemical mechanical polishing slurries
by
Hong, Seungchul
,
Han, Deoksu
,
Jang, Keon-Soo
Published in
Wear
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Influence of abrasive morphology and size dispersity of Cu barrier metal slurry on removal rates and wafer surface quality in chemical mechanical planarization
by
Hong, Seungchul
,
Han, Deoksu
,
Kwon, Jangkuk
,
Kim, Sung Jun
,
Lee, Seong Jae
,
Jang, Keon-Soo
Published in
Microelectronic engineering
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Microelectronic Engineering
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Wear
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Subjects
Abrasive
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Abrasives
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Chemical-Mechanical Polishing
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Removal Rate
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Semiconductor Devices
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Silica
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Silicon Dioxide
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Slurries
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Slurry
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Surface Roughness
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Wafer
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Abrasion
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Additives
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Bulging
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Chemical Mechanical Planarization
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Chemical Mechanical Polishing
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Contaminants
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Copper
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Defects
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Density
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Elsevier Sciencedirect Journals
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Elsevier Sd Backfile Engineering And Technology
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Elsevier Sd Backfile Materials Science
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Backfile Package - Computer Science (Legacy) [Ycs]
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Backfile Package - Physics General (Legacy) [Ypa]
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