Search Results - HangChul Choi

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  1. 1
    Thin profile flip chip package-on-package development

    Thin profile flip chip package-on-package development by Ming-Che Hsieh, KeonTaek Kang, HangChul Choi, YoungCheol Kim

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  2. 2
    Thermally enhanced and thin profile flip chip packages for Tablet processor applications

    Thermally enhanced and thin profile flip chip packages for Tablet processor applications by Eslampour, Hamid, Joshi, Mukul, KyungOe Kim, Sun Wei, JaeHan Chung, TaeWoo Lee, HangChul Choi, Emigh, Roger

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    Mixed Pitch BGA (mpBGA) packaging development for high bandwidth-high speed networking devices

    Mixed Pitch BGA (mpBGA) packaging development for high bandwidth-high speed networking devices by Savic, J., Nagar, M., Weidong Xie, Ahmad, M., Senk, D., Bansal, A., Islam, N., Park Gun Oh, Pendse, R., Choi HangChul, Lee SangHo

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