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    Impact of Electrical Contacts Design and Materials on the Stability of Ti Superconducting Transition Shape by Yefremenko, Volodymyr, Ade, Peter A. R., Ahmed, Zeeshan, Anderson, Adam J., Austermann, Jason E., Avva, Jessica S., Basu Thakur, Robitan, Bender, Amy N., Benson, Bradford A., Carlstrom, John E., Carter, Faustin W., Cecil, Thomas, Chang, Clarence L., Cliche, Jean-Francois, Cukierman, Ariel, Denison, Edward V., de Haan, Tijmen, Ding, Junjia, Divan, Ralu N. S., Dobbs, Matt A., Dutcher, Daniel, Everett, Wenderline, Foster, Allen, Gannon, Renae N., Gilbert, Adam, Groh, John, Halverson, Nils W., Harke-Hosemann, Angelina H., Harrington, Nicholas L., Henning, Jason W., Hilton, Gene C., Holzapfel, William L., Huang, Nicholas, Irwin, Kent D., Jeong, Oliver B., Jonas, Michelle, Khaire, Trupti, Kofman, Anna M., Korman, Milo, Kubik, Donna L., Kuhlmann, Steve, Kuo, Chao-Lin, Lee, Adrian T., Lowitz, Amy E., Meyer, Stephen S., Michalik, Daniel, Miller, Christina Suzanne, Montgomery, Joshua, Nadolski, Andrew, Natoli, Tyler J., Nguyen, Hogan, Noble, Gavin, Novosad, Valentine, Padin, Stephen, Pan, Zhaodi, Pearson, John, Posada, Chrystian M., Rahlin, Alexandra, Ruhl, John E., Saunders, L. J., Sayre, James T., Shirley, Ian, Shirokoff, Erik D., Smecher, Graeme, Sobrin, Joshua A., Stan, Liliana, Stark, Antony A., Story, Kyle T., Suzuki, Aritoki, Tang, Qing Yang, Thompson, Keith L., Tucker, Carole E., Vale, Leila R., Vanderlinde, Keith, Vieira, Joaquin D., Wang, Gensheng, Whitehorn, Nathan, Yoon, Ki Won, Young, Matt

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