Search Results - Hemmetzberger, D.

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  1. 1
    The challenge of ultra thin chip assembly

    The challenge of ultra thin chip assembly by FEIL, Michael, ADLER, Cliff, HEMMETZBERGER, Dieter, KÖNIG, Martin, BOCK, Karlheinz

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  2. 2
    Electrical stress on intrinsically conductive polymer layer

    Electrical stress on intrinsically conductive polymer layer by Bonfert, D., Hemmetzberger, D., Bose, I., Klink, G., Bock, K., Svasta, P., Ionescu, C.

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  3. 3
    Large Area Cost-Efficient Electronics Systems Integration

    Large Area Cost-Efficient Electronics Systems Integration by Bock, K., Klink, G., Strohhofer, C., Hemmetzberger, D., Feil, M.

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    Reel-to-Reel Fabrication of Integrated Circuits Based on Soluble Polymer Semiconductor

    Reel-to-Reel Fabrication of Integrated Circuits Based on Soluble Polymer Semiconductor by Klink, G., Hammerl, E., Drost, A., Hemmetzberger, D., Bock, K.

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