Investigation of fundamental EMI source mechanisms driving common-mode radiation from printed circuit boards with attached cables by Hockanson, D.M., Drewniak, J.L., Hubing, T.H., Van Doren, T.P., Fei Sha, Wilhelm, M.J.

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EMI mitigation with multilayer power-bus stacks and via stitching of reference planes by Xiaoning Ye, Hockanson, D.A., Min Li, Yong Ren, Wei Cui, Drewniak, J.L., DuBroff, R.E.

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Power bus decoupling on multilayer printed circuit boards by Hubing, T.H., Drewniak, J.L., Van Doren, T.P., Hockanson, D.M.

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FDTD modeling of common-mode radiation from cables by Hockanson, D.M., Drewniak, J.L., Hubing, T.H., Van Doren, T.P.

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High-performance inter-PCB connectors: analysis of EMI characteristics by Xiaoning Ye, Drewniak, J.L., Nadolny, J., Hockanson, D.M.

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FDTD and experimental investigation of EMI from stacked-card PCB configurations by Hockanson, D.M., Xiaoning Ye, Drewniak, J.L., Hubing, T.H., Van Doren, T.P., Dubroff, R.E.

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Numerical and experimental corroboration of an FDTD thin-slot model for slots near corners of shielding enclosures by Min Li, Kuang-Ping Ma, Hockanson, D.M., Drewniak, J.L., Hubing, T.H., Van Doren, T.P.

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An investigation of PCB radiated emissions from simultaneous switching noise by Radu, S., Hockanson, D.

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METHOD OF EDGE CURRENTS FOR CALCULATING MUTUAL EXTERNAL INDUCTANCE IN A MICROSTRIP STRUCTURE by Koledintseva, Marina Y., Drewniak, James L., Van Doren, Thomas P., Pommerenke, David J., Cocchini, Matteo, Hockanson, David M.

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Quantifying EMI resulting from finite-impedance reference planes by Hockanson, D.M., Dreniak, J.L., Hubing, T.H., van Doren, T.P., Fei Sha, Cheung-Wei Lam

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MUTUAL EXTERNAL INDUCTANCE IN STRIPLINE STRUCTURES by Koledintseva, Marina Y., Drewniak, James L., Van Doren, Thomas P., Pommerenke, David J., Cocchini, Matteo, Hockanson, David M.

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Distributed SPICE circuit model for ceramic capacitors by Smith, L.D., Hockanson, D.

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Stop that noise by Van Doren, T., Hubing, T., Fei Sha, Drewniak, J., Hockanson, D.

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A transmission-line model for ceramic capacitors for CAD tools based on measured parameters by Smith, L.D., Hockanson, D., Kothari, K.

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Investigation of split groundplanes at the connector for EMI control by Hockanson, D., Drewniak, J.L., Nuebel, J., Parker, J.C.

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The effect of corrosion on shielding effectiveness of a zinc-coated steel enclosure by Das, S.K., Nuebel, J., Zand, B., Hockanson, D., Xie, J., Pecht, M.

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Considerations for magnetic-field coupling resulting in radiated EMI by Hockanson, D., Drewniak, J.L., DuBroff, R.E., Hubing, T.H., Van Doren, T.P.

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RF isolation using power islands in DC power bus design by Jun Fan, Yong Ren, Juan Chen, Hockanson, D.M., Hao Shi, Drewniak, J.L., Hubing, T.H., Van Doren, T.P., DuBroff, R.E.

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Investigation of EMI coupling at CPU interconnect by Hockanson, D.M., Slone, R.D.

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External parasitic inductance in microstrip and stripline geometries of finite size by Koledintseva, M.Y., Drewniak, J.L., Van Doren, T.P., Hockanson, D.M.

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