A Thermal Isolation Technique Using Through-Silicon Vias for Three-Dimensional ICs by Sanming Hu, Hoe, Yen Yi Germaine, Hongyu Li, Dan Zhao, Jinglin Shi, Yong Han, Keng Hwa Teo, Yong Zhong Xiong, Jin He, Xiaowu Zhang, Minkyu Je, Madihian, M.

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Thermo-mechanical actuator-based miniature tagging module for localization in capsule endoscopy by Chandrappan, Jayakrishnan, Ruiqi, Lim, Su, Nandar, Yi, Germaine Hoe Yen, Vaidyanathan, Kripesh

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Integrated Optical Carrier for Optical/Electrical Interconnect by Lim Teck Guan, Khoo Yee Mong, Yoon, Joey Chai Yi, Liang, Calivn Teo Wei, Yi, Germaine Hoe Yen, Yap Guan Jie, Ramana, P V, Tan Chee Wei, Damaruganath, P

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Development of Large Die Fine-Pitch Cu/Low- k FCBGA Package With Through Silicon via (TSV) Interposer by Tai Chong Chai, Xiaowu Zhang, Lau, J H, Selvanayagam, C S, Damaruganath, P, Hoe, Y Y G, Yue Ying Ong, Rao, V S, Wai, E, Hong Yu Li, Liao, E B, Ranganathan, N, Vaidyanathan, K, Shiguo Liu, Jiangyan Sun, Ravi, M, Vath, C J, Tsutsumi, Y

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Development of Large Die Fine-Pitch Cu/Low-[Formula Omitted] FCBGA Package With Through Silicon via (TSV) Interposer by Chai, Tai Chong, Zhang, Xiaowu, Lau, John H, Selvanayagam, Cheryl S, Damaruganath, Pinjala, Hoe, Yen Yi Germaine, Ong, Yue Ying, Rao, Vempati Srinivas, Wai, Eva, Li, Hong Yu, Liao, E. Bin, Ranganathan, Nagarajan, Vaidyanathan, Kripesh, Liu, Shiguo, Sun, Jiangyan, Ravi, Mullapudi, Vath, Charles J, Tsutsumi, Yoshihiro

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Effect of TSV interposer on the thermal performance of FCBGA package by Hoe, Yen Yi Germaine, Yue, Tang Gong, Damaruganath, Pinjala, Chong, Chai Tai, Lau, John H., Xiaowu, Zhang, Vaidyanathan, Kripesh

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Modeling and characterization of the thermal performance of advanced packaging materials in the flip-chip BGA and QFN packages by Hoe, Yen Yi Germaine, Yap Guan Jie, Rao, V. S., Rhee, M. W. Daniel

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Impact of advanced materials on power cycling performance and process dependent stresses of QFN by Ho Siow Ling, Ching, E. W. L., Yi, G. H. Y., Rhee, Min Woo Daniel

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A microfluidic sensor for human hydration level monitoring by Hoe, Yen Yi Germaine, Johari, Badrul Hisam, Meongkeun Ju, Sangho Kim, Vaidyanathan, Kripesh, Tae Goo Kang

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Thermal modeling and simulation of a package-on-package embedded micro wafer level package (EMWLP) structure at the package and system-level by Hoe, Y Y G, Chong Ser Choong, Rao, V S, Sharma, G, Zhang Xiaowu, Pinjala, D

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Thermal performance analysis of a 3D package by Tan, S P, Che, F X, Xiaowu Zhang, Teo, K H, Gao, S, Pinjala, D, Hoe, Y Y G

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Thermal modeling and characterization of the embedded micro wafer level package (EMWLP) at the package- and system-level by Hoe, Yen Yi Germaine, Gongyue, Tang, Sharma, Gaurav, Pinjala, Damaragunath, Rao, Vempati Srinivasa, Chinq, Jong Ming, Siang, Sharon Lim Pei, Kumar, Aditya, Wee, Ho Soon, Xiaowu, Zhang, Kripesh, V.

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