Search Results - Holdford, Becky

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    Optimization of Pb-Free Solder Joint Reliability from a Metallurgical Perspective

    Optimization of Pb-Free Solder Joint Reliability from a Metallurgical Perspective by Zeng, Kejun, Pierce, Mike, Miyazaki, Hiroshi, Holdford, Becky

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    Optimization of Pb-Free Solder Joint Reliability from a Metallurgical Perspective: Pb-free Solders and Materials for Emerging Interconnect and Packaging Technologies

    Optimization of Pb-Free Solder Joint Reliability from a Metallurgical Perspective: Pb-free Solders and Materials for Emerging Interconnect and Packaging Technologies by KEJUN ZENG, PIERCE, Mike, MIYAZAKI, Hiroshi, HOLDFORD, Becky

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    Effect of Cu content on the interfacial reliability of SnAgCu solder joints

    Effect of Cu content on the interfacial reliability of SnAgCu solder joints by Kejun Zeng, Holdford, B

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    A Method for Decapsulting Integrated Circuit Chips

    A Method for Decapsulting Integrated Circuit Chips by Holdford, Becky

    Published in Microscopy today
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