Understanding and eliminating defects in electroplated Cu films by Lu, J.P., Chen, L., Gonzalez, D., Guo, H.L., Rose, D.J., Marudachalam, M., Hsu, W.U., Liu, H.Y., Cataldi, F., Chatterjee, B., Smith, P.B., Holverson, P., Guldi, R.L., Russell, N.M., Shinn, G., Zuhoski, S., Luttmer, J.D.

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Novel high pressure low temperature aluminum plug technology for sub-0.5 mu m contact/via geometries by Dixit, G A, Chisholm, M F, Jain, M K, Weaver, T, Ting, L M, Poarch, S, Mizobuchi, K, Havemann, R H, Dobson, C D, Jeffryes, A I, Holverson, P J, Rich, Paul, Butler, D C, Hems, J

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Marathon and IRONMAN/sup TM/ testing of the Trikon Technologies Sigma ForceFill/sup TM by Strupp, J., Gonzalez, D., McKeon, D., Saran, M., Mena, R., Zuhoski, S., Niemyski, P., Holverson, P., Carrington, N., Butler, D., Dobson, C.

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Diet and exercise in noninsulin-dependent diabetes mellitus by FEUERSTEIN, B. L, WEINSTOCK, R. S

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Application of force fill Al-plug technology to 64 Mb DRAM and 0.35 /spl mu/m logic by Mizobuchi, K., Hamamoto, K., Utsugi, M., Dixit, G.A., Poarch, S., Havemann, R.H., Dobson, C.D., Jeffryes, A.I., Holverson, P.J., Rich, P., Butler, D.C., Rimmer, N., McGeown, A.

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A novel high pressure low temperature aluminum plug technology for sub-0.5 /spl mu/m contact/via geometries by Dixit, G.A., Chisholm, M.F., Jain, M.K., Weaver, T., Ting, L.M., Pearch, S., Mizobuchi, K., Havemann, R.H., Dobson, C.D., Jeffryes, A.I., Holverson, P.J., Rich, P., Butler, D.C., Hems, J.

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