Search Results - Holverson, P.J.

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  1. 1
    Application of force fill Al-plug technology to 64 Mb DRAM and 0.35 /spl mu/m logic

    Application of force fill Al-plug technology to 64 Mb DRAM and 0.35 /spl mu/m logic by Mizobuchi, K., Hamamoto, K., Utsugi, M., Dixit, G.A., Poarch, S., Havemann, R.H., Dobson, C.D., Jeffryes, A.I., Holverson, P.J., Rich, P., Butler, D.C., Rimmer, N., McGeown, A.

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    A novel high pressure low temperature aluminum plug technology for sub-0.5 /spl mu/m contact/via geometries

    A novel high pressure low temperature aluminum plug technology for sub-0.5 /spl mu/m contact/via geometries by Dixit, G.A., Chisholm, M.F., Jain, M.K., Weaver, T., Ting, L.M., Pearch, S., Mizobuchi, K., Havemann, R.H., Dobson, C.D., Jeffryes, A.I., Holverson, P.J., Rich, P., Butler, D.C., Hems, J.

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