Search Results - Hu, Yongsuan

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  1. 1
    Preparation and thermal effects of polyarylene ether nitrile aluminium nitride composites

    Preparation and thermal effects of polyarylene ether nitrile aluminium nitride composites by Chen, Yuanming, He, Wei, Zhou, Guoyun, Hu, Yongsuan, Wang, Shouxu, Tao, Zhihua

    Published in Polymer international
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  2. 2
    Incorporation of Tin on copper clad laminate to increase the interface adhesion for signal loss reduction of high-frequency PCB lamination

    Incorporation of Tin on copper clad laminate to increase the interface adhesion for signal loss reduction of high-frequency PCB lamination by Wang, Chong, Wen, Na, Zhou, Guoyun, Wang, Shouxu, He, Wei, Su, Xinhong, Hu, Yongsuan

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  3. 3
    A composite of epoxy resin/copper(II) acetylacetonae as catalyst of copper addition on insulated substrate

    A composite of epoxy resin/copper(II) acetylacetonae as catalyst of copper addition on insulated substrate by Li, Jiujuan, Zhou, Guoyun, Hong, Yan, He, Wei, Wang, Shouxu, Yang, Wenjun, Su, Xinhong, Hu, Yongsuan, Xia, Feng, Jin, Xiaofeng

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  4. 4
    Preparation and thermal effects of polyarylene ether nitrile aluminium nitride composites: AlN/PEN composites

    Preparation and thermal effects of polyarylene ether nitrile aluminium nitride composites: AlN/PEN composites by Chen, Yuanming, He, Wei, Zhou, Guoyun, Hu, Yongsuan, Wang, Shouxu, Tao, Zhihua

    Published in Polymer international
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  5. 5
    Pre-curing investigation of filling conductive paste in prepreg to interconnect two multilayer structures of backboard for press-fit application

    Pre-curing investigation of filling conductive paste in prepreg to interconnect two multilayer structures of backboard for press-fit application by Wang, Shouxu, Yang, Ting, Chen, Yuanming, He, Wei, Hu, Yongsuan, Su, Xinhong

    Published in Circuit world
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