Search Results - Hua Siong, Wong

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  1. 1
    Application of Mediation in Resolving Elderly Family Issues in Malaysia: Lessons from Canada and Australia

    Application of Mediation in Resolving Elderly Family Issues in Malaysia: Lessons from Canada and Australia by Jamaluddin, Siti Zaharah, Abu Taher, Mohammad, Wong, Hua Siong

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  2. 2
    Electronic signature and attestation in conveyancing practice: A Malaysian legal perspective [version 1; peer review: 1 approved with reservations]

    Electronic signature and attestation in conveyancing practice: A Malaysian legal perspective [version 1; peer review: 1 approved with reservations] by Hua Siong, Wong, Munzil Muhamad, Mohd

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  3. 3
    Electronic signature and attestation in conveyancing practice: A Malaysian legal perspective [version 3; peer review: 1 approved, 1 approved with reservations]

    Electronic signature and attestation in conveyancing practice: A Malaysian legal perspective [version 3; peer review: 1 approved, 1 approved with reservations] by Hua Siong, Wong, Munzil Muhamad, Mohd

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  4. 4
    A Deep Dive into the Legal Framework of Moneylenders Act 1951 in Malaysia: An Overview

    A Deep Dive into the Legal Framework of Moneylenders Act 1951 in Malaysia: An Overview by Siong, Wong Hua

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  5. 5
    Electronic signature and attestation in conveyancing practice: A Malaysian legal perspective [version 2; peer review: 1 approved, 1 approved with reservations]

    Electronic signature and attestation in conveyancing practice: A Malaysian legal perspective [version 2; peer review: 1 approved, 1 approved with reservations] by Hua Siong, Wong, Munzil Muhamad, Mohd

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  6. 6
    Morphological structure details, size distributions and magnetic properties of iron oxide nanoparticles

    Morphological structure details, size distributions and magnetic properties of iron oxide nanoparticles by Ngoi, Kuan Hoon, Wong, Jia Chyi, Chiu, Wee Siong, Chia, Chin Hua, Jin, Kyeong Sik, Kim, Hyun-Joong, Kim, Hong-Chul, Ree, Moonhor

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  7. 7
    Characterization of nonconductive adhesives for flip-chip interconnection

    Characterization of nonconductive adhesives for flip-chip interconnection by LAY KUAN TEH, CHEE CHEONG WONG, MHAISALKAR, Subodh, ONG, Kristine, POI SIONG TEO, EE HUA WONG

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  8. 8
    Moisture-induced failures of adhesive flip chip interconnects

    Moisture-induced failures of adhesive flip chip interconnects by Teh, L.K., Teo, M., Anto, E., Wong, C.C., Mhaisalkar, S.G., Teo, P.S., Wong, E.H.

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  9. 9
    Thermo-mechanical analysis for a multi chip build up substrate based package

    Thermo-mechanical analysis for a multi chip build up substrate based package by Xiaowu Zhang, Lee, C., Wong Ee Hua, Iyer, M.K., Teo Poi Siong, Pinjala, D., Srinivasamurthy, S.

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