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A Normally-Off GaN MIS-HEMT Fabricated Using Atomic Layer Etching to Improve Device Performance Uniformity for High Power Applications
by
Yang, Tsung-Ying
,
Huang, Huuan-Yao
,
Liang, Yan-Kui
,
Wu, Jui-Sheng
,
Kuo, Mei-Yan
,
Chang, Kuan-Pang
,
Hsu, Heng-Tung
,
Chang, Edward-Yi
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IEEE electron device letters
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Ieee Electron Device Letters
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Algan/Gan
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Aluminum Gallium Nitride
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Atomic Layer Etching
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Charge Trap Gate Stack
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Contact Resistance
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Engineering
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Engineering, Electrical & Electronic
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Enhancement-Mode
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Etching
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Ferroelectricity
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Gallium Nitrides
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Hemts
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High Electron Mobility Transistors
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Logic Gates
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Performance Evaluation
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