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Solder Joint Reliability (SJR) Study of Integrated Heat Spreader (IHS) Packages
by
Shaw Fong Wong
,
Wei Keat Loh
,
Kang Eu Ong
,
Yung Hsiang Lee
,
Huey Ling Lew
,
Seok Ling Lee
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Conference Proceeding
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Influence of Package Assembly Process on Solder Joint Reliability - an Application of Component Level Shock Methodology
by
Lee Yung Hsiang
,
Loh Wei Keat
,
Ee Boon Yee
,
Leong Jenn Seong
,
Lew Huey Ling
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Conference Proceeding
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Conference Proceedings
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Subjects
Assembly
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Electric Shock
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Electronics Packaging
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Soldering
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Compressive Stress
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Electronic Packaging Thermal Management
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Environmentally Friendly Manufacturing Techniques
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Flip Chip
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Integrated Heat Spreader Packages
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Lead
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Ovens
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Semiconductor Device Packaging
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Solder Joint Reliability
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Temperature
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Testing
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Thermal Resistance
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Thermal Stresses
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Thermomechanical Processes
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Ieee Electronic Library (Iel) Conference Proceedings
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