Search Results - IKAKURA, Hiroshi

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  1. 1
    Copper barrier properties of low dielectric constant SiOCNH film deposited by plasma-enhanced CVD

    Copper barrier properties of low dielectric constant SiOCNH film deposited by plasma-enhanced CVD by SHIOYA, Yoshimi, ISHIMARU, Tomomi, IKAKURA, Hiroshi, NISHIMOTO, Yuko, OHDAIRA, Toshiyuki, SUZUKI, Ryoichi, MAEDA, Kazuo

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  2. 2
    The effects of dilution gas and pressure on the properties of PE-CVD low-k film

    The effects of dilution gas and pressure on the properties of PE-CVD low-k film by SHIOYA, Yoshimi, KOTAKE, Yuichiro, ISHIMARU, Tomomi, MASUBUCHI, Tomoaki, IKAKURA, Hiroshi, OHGAWARA, Shouji, MAEDA, Kazuo

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  3. 3
    Properties of Low-k Copper Barrier SiOCH Film Deposited by PECVD Using Hexamethyldisiloxane and N[sub 2]O

    Properties of Low-k Copper Barrier SiOCH Film Deposited by PECVD Using Hexamethyldisiloxane and N[sub 2]O by Ishimaru, Tomomi, Shioya, Yoshimi, Ikakura, Hiroshi, Nozawa, Mamoru, Ohgawara, Shoji, Ohdaira, Toshiyuki, Suzuki, Ryoichi, Maeda, Kazuo

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  4. 4
    Surface morphologies of sputter-deposited aluminum films studied using a high-resolution phase-measuring laser interferometric microscope

    Surface morphologies of sputter-deposited aluminum films studied using a high-resolution phase-measuring laser interferometric microscope by Furukawa, M, Yamamoto, Y, Ikakura, H, Tanaka, N, Hashimoto, M, Sano, A, Shingubara, S

    Published in Applied optics (2004)
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  5. 5
    Properties of low-k copper barrier SiOCH film deposited by PECVD using hexamethyldisiloxane and N2O

    Properties of low-k copper barrier SiOCH film deposited by PECVD using hexamethyldisiloxane and N2O by ISHIMARU, Tomomi, SHIOYA, Yoshimi, IKAKURA, Hiroshi, NOZAWA, Mamoru, OHGAWARA, Shoji, OHDAIRA, Toshiyuki, SUZUKI, Ryoichi, MAEDA, Kazuo

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  6. 6
    Properties of Low- k Cu Barrier SiOCNH Film Deposited by Plasma-Enhanced Chemical Vapor Deposition using Hexamethyldisiloxane and Ammonia Gases

    Properties of Low- k Cu Barrier SiOCNH Film Deposited by Plasma-Enhanced Chemical Vapor Deposition using Hexamethyldisiloxane and Ammonia Gases by Shioya, Yoshimi, Maeda, Kazuo, Ishimaru, Tomomi, Ikakura, Hiroshi, Masubuchi, Tomoaki, Ohdaira, Toshiyuki, Suzuki, Ryoichi

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  7. 7
    Comparison of Deposition Characteristics between Triethyl and Trimethyl Borates in an Atmospheric Pressure Chemical Vapor Deposition Equipment with Tetraethyl Orthosilicate and O 3

    Comparison of Deposition Characteristics between Triethyl and Trimethyl Borates in an Atmospheric Pressure Chemical Vapor Deposition Equipment with Tetraethyl Orthosilicate and O 3 by Yamamoto, Yoshito, Ikakura, Hiroshi, Ohgawara, Shoji, Furukawa, Masakazu

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