Search Results - Illyefalvi-Vitez, Z

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  1. 1
    SensEdu - an Internet course for teaching sensorics

    SensEdu - an Internet course for teaching sensorics by Harsanyi, G., Lepsenyi, I., Gordon, P., Bojta, P., Ballun, G., Illyefalvi-Vitez, Z.

    Published in IEEE sensors journal
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  2. 2
    Laser processing for microelectronics packaging applications

    Laser processing for microelectronics packaging applications by Illyefalvi-Vitéz, Zsolt

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  3. 3
    Distance learning : How to use this new didactic method in education of electronics engineering?

    Distance learning : How to use this new didactic method in education of electronics engineering? by ILLYEFALVI-VITEZ, Zsolt, GORDON, Peter

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  4. 4
    Analysis of distance learning courses offered by the EuroTraining course directory

    Analysis of distance learning courses offered by the EuroTraining course directory by Illyefalvi-Vitez, Z., Harsanyi, G., Balogh, B., Civera, P.

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  5. 5
    Low temperature soldering on biopolymer (PLA) Printed Wiring Board substrate

    Low temperature soldering on biopolymer (PLA) Printed Wiring Board substrate by Geczy, A., Lener, V., Hajdu, I., Illyefalvi-Vitez, Z.

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  6. 6
    Effect of patterned copper layer on selective polymer removal by 355 nm laser

    Effect of patterned copper layer on selective polymer removal by 355 nm laser by Balogh, B., Gordon, P., Berenyi, R., Illyefalvi-Vitez, Z.

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  7. 7
    Failure and acceleration models for MCM-Ls tested by HAST

    Failure and acceleration models for MCM-Ls tested by HAST by Illyefalvi-Vitez, Z., Nemeth, P., Bojta, P.

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  8. 8
    A multimedia course for the design of microsystem packages

    A multimedia course for the design of microsystem packages by Illyefalvi-Vitez, Z., Ruszinko, M., Codreanu, N.-D., Hertel, L., Bojta, P.

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  9. 9
    Recent advancements in MCM-L imaging and via generation by laser direct writing

    Recent advancements in MCM-L imaging and via generation by laser direct writing by Illyefalvi-Vitez, Z., Ruszinko, M., Pinkola, J.

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  10. 10
    Defect analysis of ultrasonic al wire bonds on Ni-plated package leads

    Defect analysis of ultrasonic al wire bonds on Ni-plated package leads by Batorfi, R., Illyefalvi-Vitez, Z.

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  11. 11
    Mechanical properties of thermosonic thin gold wire bonds

    Mechanical properties of thermosonic thin gold wire bonds by Batorfi, R., Illyefalvi-Vitez, Z.

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  12. 12
    Networking the electronics packaging education

    Networking the electronics packaging education by Illyefalvi-Vitez, Z., Golonka, L., Mach, P., Nicolics, J., Svasta, P.

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  13. 13
    Process parameter optimization of selective soldering

    Process parameter optimization of selective soldering by Olah, Z., Ruszinko, M., Batorfi, R., Illyefalvi-Vitez, Z.

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  14. 14
    Investigating PCB traces for fine pitch applications

    Investigating PCB traces for fine pitch applications by Geczy, A, Illyefalvi-Vitez, Z

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  15. 15
    Internet-based performance centered instruction - the link between work and education in microelectronics

    Internet-based performance centered instruction - the link between work and education in microelectronics by Tzanova, S., Schaeffer, C., Tardif, C., Royer, N., Illyefalvi-Vitez, Z., Mouthaan, T.

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  16. 16
    Review of the reliability of advanced component packaging technologies

    Review of the reliability of advanced component packaging technologies by Nemeth, P., Illyefalvi-Vitez, Z., Harsanyi, G.

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  17. 17
    Board design optimization for fine pitch BGA components

    Board design optimization for fine pitch BGA components by Geczy, A, Illyefalvi-Vitez, Z

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  18. 18
    Mechanical and structural analysis of thermosonic wire bonds

    Mechanical and structural analysis of thermosonic wire bonds by Szecsenyi, J., Batorfi, R., Illyefalvi-Vitez, Z.

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  19. 19
    Laser via generation into flexible substrates

    Laser via generation into flexible substrates by Illyefalvi-Vitez, Z., Berenyi, R., Gordon, P., Pinkola, J., Ruszinko, M., Vanfleteren, J.

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  20. 20
    Pressure sensing: A novel method for characterizing the processing zone in Vapour Phase Soldering systems

    Pressure sensing: A novel method for characterizing the processing zone in Vapour Phase Soldering systems by Geczy, A., Peter, Z., Illes, B., Illyefalvi-Vitez, Z.

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