Search Results - Interrante, Marcus

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  1. 1
    An enhanced thermo-compression bonding process to address warpage in 3D integration of large die on organic substrates

    An enhanced thermo-compression bonding process to address warpage in 3D integration of large die on organic substrates by Sakuma, Katsuyuki, Tunga, Krishna, Webb, Buck, Ramachandran, Koushik, Interrante, Marcus, Hsichang Liu, Angyal, Matthew, Berger, Daniel, Knickerbocker, John, Iyer, Subramanian

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    Flip chip assembly method employing differential heating/cooling for large dies with coreless substrates

    Flip chip assembly method employing differential heating/cooling for large dies with coreless substrates by Sakuma, Katsuyuki, Blackshear, Edmund, Tunga, Krishna, Chenzhou Lian, Shidong Li, Interrante, Marcus, Mantilla, Oswald, Jae-Woong Nah

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