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Local Strain Distribution and Microstructure of Grinding-Induced Damage Layers in SiC Wafer
by
Tsukimoto, Susumu
,
Ise, Tatsuhiko
,
Maruyama, Genta
,
Hashimoto, Satoshi
,
Sakurada, Tsuguo
,
Senzaki, Junji
,
Kato, Tomohisa
,
Kojima, Kazutoshi
,
Okumura, Hajime
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Journal of electronic materials
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Journal Of Electronic Materials
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Characterization And Evaluation Of Materials
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Chemistry And Materials Science
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Compressive Properties
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Crystal Defects
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Damage Assessment
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Damage Layer
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Defect
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Defects
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Deformation
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Diamonds
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Dislocation Density
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Electron Backscatter Diffraction
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Electronics And Microelectronics
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Engineering
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Engineering, Electrical & Electronic
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Grinding
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Inhomogeneity
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Instrumentation
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Springer Nature
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Springer Nature - Connect Here First To Enable Access
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Springerlink Contemporary (1997 - Present)
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