Search Results - Itoi, Kazuhisa

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  1. 1
    On-Chip Yagi–Uda Antenna for Horizontal Wireless Signal Transmission in Stacked Multi Chip Packaging

    On-Chip Yagi–Uda Antenna for Horizontal Wireless Signal Transmission in Stacked Multi Chip Packaging by Ohashi, Kazuma, Yammouch, Tackya, Kimura, Makoto, Ito, Hiroyuki, Okada, Kenichi, Itoi, Kazuhisa, Sato, Masakazu, Ito, Tatsuya, Yamauchi, Ryozo, Masu, Kazuya

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  2. 2
    Thin Film Magneto-Impedance Sensor Integrated Into L10 FePt Thin Film Bias Magnet

    Thin Film Magneto-Impedance Sensor Integrated Into L10 FePt Thin Film Bias Magnet by OHMORI, Kenichi, KENJI TAN, ITOI, Kazuhisa, NAGASU, Katsubumi, UEMICHI, Yusuke, AIZAWA, Takuya, YAMAUCHI, Ryozo

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  3. 3
    On-chip high-Q variable inductor using wafer-level chip-scale package technology

    On-chip high-Q variable inductor using wafer-level chip-scale package technology by OKADA, Kenichi, SUGAWARA, Hirotaka, ITO, Hiroyuki, ITOI, Kazuhisa, SATO, Masakazu, ABE, Hiroshi, ITO, Tatsuya, MASU, Kazuya

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  4. 4
    Phase diagrams in the solid solution Nd-Ba-Cu-O system and NdBa2Cu3O7-δ single crystals growth by the traveling-solvent floating-zone method

    Phase diagrams in the solid solution Nd-Ba-Cu-O system and NdBa2Cu3O7-δ single crystals growth by the traveling-solvent floating-zone method by KURODA, K, ITOI, K, OKANO, J.-I, SEGAWA, S, ABE, K, CHOI, I.-H, UNOKI, H, KOSHIZUKA, N

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  5. 5
    Phase Diagrams in the Solid Solution Nd–Ba–Cu–O System and NdBa 2 Cu 3 O 7-δ Single Crystals Growth by the Traveling-Solvent Floating-Zone Method

    Phase Diagrams in the Solid Solution Nd–Ba–Cu–O System and NdBa 2 Cu 3 O 7-δ Single Crystals Growth by the Traveling-Solvent Floating-Zone Method by Kuroda, Kiyoshi, Itoi, Kazuhisa, Okano, Jun-ichi, Segawa, Souichi, Abe, Keita, Choi, In-Hwan, Hiromi Unoki, Hiromi Unoki, Naoki Koshizuka, Naoki Koshizuka

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  6. 6
    A 5.2 GHz CMOS Low Noise Amplifier with High-Q Inductors Embedded in Wafer-Level Chip-Scale Package

    A 5.2 GHz CMOS Low Noise Amplifier with High-Q Inductors Embedded in Wafer-Level Chip-Scale Package by Fukuda, S., Ito, H., Itoi, K., Sato, M., Ito, T., Yamauchi, R., Okada, K., Masu, K.

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  7. 7
    Comparison of compact on-chip inductors embedded in wafer-level package

    Comparison of compact on-chip inductors embedded in wafer-level package by Itoi, K., Sato, M., Okada, K., Masu, K., Ito, T.

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  8. 8
    On-chip high-Q Cu inductors embedded in wafer-level chip- scale package for silicon RF application

    On-chip high-Q Cu inductors embedded in wafer-level chip- scale package for silicon RF application by ITOI, Kazuhisa, SATO, Masakazu, ABE, Hiroshi, SUGAWARA, Hirotaka, ITO, Hiroyuki, OKADA, Kenichi, MASU, Kazuya, ITO, Tatsuya

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  9. 9
    Conductive interconnections through thick silicon substrates for 3D packaging

    Conductive interconnections through thick silicon substrates for 3D packaging by Takizawa, T., Yamamoto, S., Itoi, K., Suemasu, T.

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  10. 10
    Distributed constant passive devices using wafer-level chip scale package technology for one-chip wireless communication circuits

    Distributed constant passive devices using wafer-level chip scale package technology for one-chip wireless communication circuits by Seita, J., Ito, H., Sugita, H., Okada, K., Ito, T., Itoi, K., Sato, M., Masu, K.

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  11. 11
    High-Q variable inductor using redistributed layers for Si RF circuits

    High-Q variable inductor using redistributed layers for Si RF circuits by Sugawara, H., Ito, H., Okada, K., Itoi, K., Sato, M., Abe, H., Ito, T., Masu, K.

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  12. 12
    Microwave operation of on-chip antenna embedded in WL-CSP [RFID applications]

    Microwave operation of on-chip antenna embedded in WL-CSP [RFID applications] by Abe, H., Sato, M., Itoi, K., Kawai, S., Tanaka, T., Hayashi, T., Saitoh, Y., Ito, T.

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  13. 13
    On-chip high-Q solenoid inductors embedded in WL-CSP

    On-chip high-Q solenoid inductors embedded in WL-CSP by Itoi, K., Sato, M., Abe, H., Ito, H., Sugawara, H., Okada, K., Masu, K., Ito, T.

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