Search Results - Ivy, Bob

Refine Results
  1. 1
    LETTERS TO THE EDITOR

    LETTERS TO THE EDITOR by Erikson, R., Greger, Rene, Morales, Robert R., Ivy, Bob, Podhorsky, Rene, Friedman, Norman, Dickson, W. D., Caruana, Joseph

    Published in Warship international
    Get full text
    Magazinearticle
    Save to List
    Saved in:
  2. 2
    Effectiveness of Pfizer-BioNTech and Moderna Vaccines Against COVID-19 Among Hospitalized Adults Aged ≥65 Years - United States, January-March 2021

    Effectiveness of Pfizer-BioNTech and Moderna Vaccines Against COVID-19 Among Hospitalized Adults Aged ≥65 Years - United States, January-March 2021 by Tenforde, Mark W, Olson, Samantha M, Self, Wesley H, Talbot, H Keipp, Lindsell, Christopher J, Steingrub, Jay S, Shapiro, Nathan I, Ginde, Adit A, Douin, David J, Prekker, Matthew E, Brown, Samuel M, Peltan, Ithan D, Gong, Michelle N, Mohamed, Amira, Khan, Akram, Exline, Matthew C, Files, D Clark, Gibbs, Kevin W, Stubblefield, William B, Casey, Jonathan D, Rice, Todd W, Grijalva, Carlos G, Hager, David N, Shehu, Arber, Qadir, Nida, Chang, Steven Y, Wilson, Jennifer G, Gaglani, Manjusha, Murthy, Kempapura, Calhoun, Nicole, Monto, Arnold S, Martin, Emily T, Malani, Anurag, Zimmerman, Richard K, Silveira, Fernanda P, Middleton, Donald B, Zhu, Yuwei, Wyatt, Dayna, Stephenson, Meagan, Baughman, Adrienne, Womack, Kelsey N, Hart, Kimberly W, Kobayashi, Miwako, Verani, Jennifer R, Patel, Manish M

    Get full text
    Items that this one cites
    Items that cite this one
    Article
    Save to List
    Saved in:
  3. 3
    Behavior of palladium and its impact on intermetallic growth in palladium-coated Cu wire bonding

    Behavior of palladium and its impact on intermetallic growth in palladium-coated Cu wire bonding by Xu, Hui, Qin, Ivy, Clauberg, Horst, Chylak, Bob, Acoff, Viola L.

    Published in Acta materialia
    Get full text
    Items that this one cites
    Items that cite this one
    Article
    Save to List
    Saved in:
  4. 4
    New observation of nanoscale interfacial evolution in micro Cu–Al wire bonds by in-situ high resolution TEM study

    New observation of nanoscale interfacial evolution in micro Cu–Al wire bonds by in-situ high resolution TEM study by Xu, Hui, Qin, Ivy, Clauberg, Horst, Chylak, Bob, Acoff, Viola L.

    Published in Scripta materialia
    Get full text
    Items that this one cites
    Items that cite this one
    Article
    Save to List
    Saved in:
  5. 5
    Ball Bond Process Optimization with Cu and Pd-Coated Cu Wire

    Ball Bond Process Optimization with Cu and Pd-Coated Cu Wire by Qin, Ivy W., Chylak, Bob, Clauberg, Horst, Shah, Aashish, Foley, John

    Get full text
    Items that cite this one
    Conference Proceeding
    Save to List
    Saved in:
  6. 6
    Advances in Wire Bonding Technology for 3D Die Stacking and Fan Out Wafer Level Package

    Advances in Wire Bonding Technology for 3D Die Stacking and Fan Out Wafer Level Package by Qin, Ivy, Yauw, Oranna, Schulze, Gary, Shah, Aashish, Chylak, Bob, Wong, Nelson

    Request full text
    Conference Proceeding
    Save to List
    Saved in:
  7. 7
    Efficacy of treatment in an opioid -dependent population group using the Maudsley Addiction Profile (MAP) tool

    Efficacy of treatment in an opioid -dependent population group using the Maudsley Addiction Profile (MAP) tool by Collins, Ruth, Boggs, Bob, Taggart, Noel, Kelly, Martin, Drillington, Aileen, Swanton, Ivy, Patterson, Diane

    Published in Ulster medical journal
    Get full text
    Article
    Save to List
    Saved in:
  8. 8
    Advances in Wire Bonding Technology to Overcome Resonance Conditions

    Advances in Wire Bonding Technology to Overcome Resonance Conditions by Shah, Aashish, Schulze, Gary, Brunner, Jon, Qin, Ivy, Chylak, Bob, Wong, Nelson

    Request full text
    Conference Proceeding
    Save to List
    Saved in:
  9. 9
    Development of advanced wire bonding technology for QFN devices

    Development of advanced wire bonding technology for QFN devices by Hui Xu, Rezvani, Alireza, Brunner, Jon, Foley, John, Qin, Ivy, Chylak, Bob

    Request full text
    Items that cite this one
    Conference Proceeding
    Save to List
    Saved in:
  10. 10
    Molded reliability study for different Cu wire bonding configurations

    Molded reliability study for different Cu wire bonding configurations by Qin, Ivy, Hui Xu, Milton, Basil, Clauberg, Horst, Chylak, Bob, Abe, Hidenori, Dongchul Kang, Endo, Yoshinori, Osaka, Masahiko, Nakamura, Shinya

    Request full text
    Items that cite this one
    Conference Proceeding
    Save to List
    Saved in:
  11. 11
    Process optimization and reliability study for Cu wire bonding advanced nodes

    Process optimization and reliability study for Cu wire bonding advanced nodes by Qin, Ivy, Hui Xu, Milton, Basil, Mendoza, Nestor, Clauberg, Horst, Chylak, Bob, Abe, Hidenori, Dongchul Kang, Endo, Yoshinori, Osaka, Masahiko, Nakamura, Shinya

    Request full text
    Items that cite this one
    Conference Proceeding
    Save to List
    Saved in:
  12. 12
    Wire bonding of Cu and Pd coated Cu wire: Bondability, reliability, and IMC formation

    Wire bonding of Cu and Pd coated Cu wire: Bondability, reliability, and IMC formation by Qin, I., Hui Xu, Clauberg, H., Cathcart, R., Acoff, V. L., Chylak, B., Cuong Huynh

    Request full text
    Conference Proceeding
    Save to List
    Saved in:
  13. 13
    Pd-coated Cu wire bonding technology: Chip design, process optimization, production qualification and reliability test for high reliability semiconductor devices

    Pd-coated Cu wire bonding technology: Chip design, process optimization, production qualification and reliability test for high reliability semiconductor devices by Singh, I., Qin, Ivy, Hui Xu, Cuong Huynh, Shin Low, Clauberg, H., Chylak, B., Acoff, V. L.

    Request full text
    Conference Proceeding
    Save to List
    Saved in:
  14. 14
    Copper high volume manufacturing R&D to production

    Copper high volume manufacturing R&D to production by Chylak, B., Clauberg, H., Foley, J., Qin, I., Milton, B.

    Request full text
    Conference Proceeding
    Save to List
    Saved in:
  15. 15
    TEM study on interface of palladium coated copper wire bonding on aluminum metallization

    TEM study on interface of palladium coated copper wire bonding on aluminum metallization by Hui Xu, Qin, I., Shah, Ashish, Clauberg, H., Chylak, B., Acoff, V. L.

    Request full text
    Conference Proceeding
    Save to List
    Saved in:
  16. 16
    Advanced wire bond looping technology for emerging packages

    Advanced wire bond looping technology for emerging packages by Brunner, J., Wei Qin, I., Chylak, B.

    Request full text
    Items that cite this one
    Conference Proceeding
    Save to List
    Saved in:
  17. 17
    Return to grassy narrows: a poisoned community tells its 40-year-old story

    Return to grassy narrows: a poisoned community tells its 40-year-old story by Rodgers, Bob, Keewatin, Ivy

    Get full text
    Magazinearticle
    Save to List
    Saved in:
  18. 18
    Back to the future

    Back to the future by Thompson, Bob, Boese, David, Keppel-Jones, Steve, Weir, Ivy, Youssef, Marten

    Published in Maclean's (Toronto)
    Get full text
    Magazinearticle
    Save to List
    Saved in:
  19. 19
    Back to the future

    Back to the future by Thompson, Bob, Boese, David, Keppel-Jones, Steve, Weir, Ivy, Youssef, Marten

    Published in Maclean's (Toronto)
    Get full text
    Magazinearticle
    Save to List
    Saved in:
  20. 20
    Back to the future

    Back to the future by Thompson, Bob, Boese, David, Keppel-Jones, Steve, Weir, Ivy, Youssef, Marten

    Published in Maclean's (Toronto)
    Get full text
    Magazinearticle
    Save to List
    Saved in:

Search Tools: