Fabrication of High Aspect Ratio TSV and Assembly With Fine-Pitch Low-Cost Solder Microbump for Si Interposer Technology With High-Density Interconnects by Aibin Yu, Lau, J. H., Soon Wee Ho, Kumar, A., Wai Yin Hnin, Wen Sheng Lee, Ming Ching Jong, Sekhar, V. N., Kripesh, V., Pinjala, D., Chen, S., Chien-Feng Chan, Chun-Chieh Chao, Chi-Hsin Chiu, Chih-Ming Huang, Chen, C.

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Development of 25-μm-Pitch Microbumps for 3-D Chip Stacking by AIBIN YU, KUMAR, Aditya, CHAN, Chien-Feng, CHAO, Chun-Chieh, CHIU, Chi-Hsin, CHAN, Chang-Yueh, CHANG, Chin-Huang, HUANG, Chih-Ming, CARL CHEN, SOON WEE HO, HNIN WAI YIN, LAU, John H, SU, Nandar, KHONG CHEE HOUE, JONG MING CHING, KRIPESH, Vaidyanathan, CHEN, Scott

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FOWLP and Si-Interposer for High-Speed Photonic Packaging by Guan, Lim Teck, Ching, Eva Wai Leong, Ching, Jong Ming, Leng, Loh Woon, Wee, David Ho Soon, Bhattacharya, Surya

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Three dimensional interconnects with high aspect ratio TSVs and fine pitch solder microbumps by Yu, A., Lau, J.H., Soon Wee Ho, Kumar, A., Hnin Wai Yin, Jong Ming Ching, Kripesh, V., Pinjala, D., Chen, S., Chien-Feng Chan, Chun-Chieh Chao, Chi-Hsin Chiu, Chih-Ming Huang, Chen, C.

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Development of Fine Pitch Solder Microbumps for 3D Chip Stacking by Aibin Yu, Kumar, A., Soon Wee Ho, Hnin Wai Yin, Lau, J.H., Khong Chee Houe, Lim Pei Siang, S., Xiaowu Zhang, Da-Quan Yu, Nandar Su, Chew Bi-Rong, M., Jong Ming Ching, Tan Teck Chun, Kripesh, V., Lee, C., Jun Pin Huang, Chiang, J., Chen, S., Chi-Hsin Chiu, Chang-Yueh Chan, Chin-Huang Chang, Chih-Ming Huang, Cheng-Hsu Hsiao

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Vertical Stacking of Heterogeneous Chiplets of Duplexer on LNA/SOI by Chong, Chai Tai, Rotaru, Mihai, Xiangyu, Wang, Pei Siang, Sharon Lim, Lin, Ji, Mandal, Rathin, Mani, Raju, Chinq, Jong Ming, Yong Liang, Ye

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Development of 25-[Formula Omitted]-Pitch Microbumps for 3-D Chip Stacking by Yu, Aibin, Kumar, Aditya, Ho, Soon Wee, Yin, Hnin Wai, Lau, John H, Su, Nandar, Houe, Khong Chee, Ching, Jong Ming, Kripesh, Vaidyanathan, Chen, Scott, Chan, Chien-Feng, Chao, Chun-Chieh, Chiu, Chi-Hsin, Chan, Chang-Yueh, Chang, Chin-Huang, Huang, Chih-Ming, Chen, Carl

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Development of 25- \mu -Pitch Microbumps for 3-D Chip Stacking by Aibin Yu, Kumar, A., Soon Wee Ho, Hnin Wai Yin, Lau, J. H., Su, Nandar, Khong Chee Houe, Jong Ming Ching, Kripesh, V., Chen, S., Chien-Feng Chan, Chun-Chieh Chao, Chi-Hsin Chiu, Chang-Yueh Chan, Chin-Huang Chang, Chih-Ming Huang, Chen, C.

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Development of 25- mu rm m -Pitch Microbumps for 3-D Chip Stacking by Yu, Aibin, Kumar, Aditya, Ho, Soon Wee, Yin, Hnin Wai, Lau, John H, Su, Nandar, Houe, Khong Chee, Ching, Jong Ming, Kripesh, Vaidyanathan, Chen, Scott, Chan, Chien-Feng, Chao, Chun-Chieh, Chiu, Chi-Hsin, Chan, Chang-Yueh, Chang, Chin-Huang, Huang, Chih-Ming, Chen, Carl

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Assembly and reliability of micro-bumped chips with Through-silicon Vias (TSV) interposer by Ong, Yue Ying, Chai, Tai Chong, Yu, Daquan, Thew, Meei Leng, Myo, Eipa, Wai, Leong Ching, Jong, Ming Chinq, Rao, Vempati Srinivasa, Su, Nandar, Zhang, Xiaowu, Damaruganath, Pinjala

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Antioxidative status of patients with alcoholic liver disease in southeastern Taiwan by Chen, Ya-Ling, Chen, Li-Ju, Bair, Ming-Jong, Yao, Mei-Lan, Peng, Hsiang-Chi, Yang, Sien-Sing, Yang, Suh-Ching

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Study of 15µm pitch solder microbumps for 3D IC integration by Aibin Yu, Lau, J.H., Soon Wee Ho, Kumar, A., Wai Yin Hnin, Da-Quan Yu, Ming Ching Jong, Kripesh, V., Pinjala, D., Dim-Lee Kwong

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Reliability of Cu/low-k wafer level package (WLP) by Seung Wook Yoon, Wirtasa, D., Lim, S., Jong Ming Ching, Kripesh, V.

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Design, Assembly and Reliability of Large Die (21 x 21mm2) and Fine-pitch (150pm) Cu/Low-K Flip Chip Package by Ong, Y.Y., Vaidyanathan, K., Ho, S.W., Sekhar, V.N., Jong, M.C., Wai, L.C., Rao, V.S., Sheng, V., Ong, J., Ong, X., Zhang, X., Seung, Y.U., Lau, J., Lim, Y.K., Yeo, D., Chan, K.C., Yanfeng, Z., Tan, J.B., Sohn, D.K.

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First-in-Asian double-blind randomized trial to assess the efficacy and safety of insulin sensitizer in nonalcoholic steatohepatitis patients by Huang, Jee-Fu, Dai, Chia-Yen, Huang, Chung-Feng, Tsai, Pei-Chien, Yeh, Ming-Lun, Hsu, Po-Yau, Huang, Shiu-Feng, Bair, Ming-Jong, Hou, Nai-Jen, Huang, Ching-I, Liang, Po-Cheng, Lin, Yi-Hung, Wang, Chih-Wen, Hsieh, Ming-Yen, Chen, Shinn-Chern, Lin, Zu-Yau, Yu, Ming-Lung, Chuang, Wan-Long

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Ultralow contact resistance between semimetal and monolayer semiconductors by Shen, Pin-Chun, Su, Cong, Lin, Yuxuan, Chou, Ang-Sheng, Cheng, Chao-Ching, Park, Ji-Hoon, Chiu, Ming-Hui, Lu, Ang-Yu, Tang, Hao-Ling, Tavakoli, Mohammad Mahdi, Pitner, Gregory, Ji, Xiang, Cai, Zhengyang, Mao, Nannan, Wang, Jiangtao, Tung, Vincent, Li, Ju, Bokor, Jeffrey, Zettl, Alex, Wu, Chih-I, Palacios, Tomás, Li, Lain-Jong, Kong, Jing

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The efficacy of multi‐disciplinary lifestyle modifications in Taiwanese nonalcoholic steatohepatitis patients by Yeh, Ming‐Lun, Dai, Chia‐Yen, Huang, Chung‐Feng, Huang, Shiu‐Feng, Tsai, Pei‐Chien, Hsu, Po‐Yau, Huang, Ching‐I, Wei, Yu‐Ju, Liang, Po‐Cheng, Bair, Ming‐Jong, Lee, Mei‐Hsuan, Lin, Zu‐Yau, Huang, Jee‐Fu, Yu, Ming‐Lung, Chuang, Wan‐Long

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Toward sustainability: using big data to explore the decisive attributes of supply chain risks and uncertainties by Wu, Kuo-Jui, Liao, Ching-Jong, Tseng, Ming-Lang, Lim, Ming K., Hu, Jiayao, Tan, Kimhua

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A traditional Chinese medicine formula NRICM101 to target COVID-19 through multiple pathways: A bedside-to-bench study by Tsai, Keng-Chang, Huang, Yi-Chia, Liaw, Chia-Ching, Tsai, Chia-I, Chiou, Chun-Tang, Lin, Chien-Jung, Wei, Wen-Chi, Lin, Sunny Jui-Shan, Tseng, Yu-Hwei, Yeh, Kuo-Ming, Lin, Yi-Ling, Jan, Jia-Tsrong, Liang, Jian-Jong, Liao, Chun-Che, Chiou, Wen-Fei, Kuo, Yao-Haur, Lee, Shen-Ming, Lee, Ming-Yung, Su, Yi-Chang

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Understanding Charge Storage Mechanisms for Amorphous MoSnSe1.5S1.5 Nanoflowers in Alkali‐Ion Batteries by Chang, Yu‐Ming, Wen, Yu‐Ching, Chen, Tsung‐Yi, Lin, Chia‐Ching, Huang, Shao‐Chu, Ni, Chung‐Sheng, Hou, An‐Yuan, Hu, Chih‐Wei, Liao, Yan‐Fa, Kuo, Chun‐Han, Liu, Shih‐Fu, Wu, Wen‐Wei, Li, Lain‐Jong, Chen, Han‐Yi

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