Compact Wavelength-Selective Functions in Silicon-on-Insulator Photonic Wires by Bogaerts, Wim, Dumon, Pieter, Van Thourhout, Dries, Taillaert, Dirk, Jaenen, Patrick, Wouters, Johan, Beckx, Stephan, Wiaux, Vincent, Baets, Roel G.

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Fabrication of Photonic Wire and Crystal Circuits in Silicon-on-Insulator Using 193-nm Optical Lithography by Selvaraja, S.K., Jaenen, P., Bogaerts, W., Van Thourhout, D., Dumon, P., Baets, R.

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Study of novel EUVL mask absorber candidates by Wu, Meiyi, Thakare, Devesh, de Marneffe, Jean-François, Jaenen, Patrick, Souriau, Laurent, Opsomer, Karl, Soulié, Jean-Philippe, Erdmann, Andreas, Mesilhy, Hazem, Naujok, Philipp, Foltin, Markus, Soltwisch, Victor, Saadeh, Qais, Philipsen, Vicky

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3-D Wafer-Level Packaging Die Stacking Using Spin-on-Dielectric Polymer Liner Through-Silicon Vias by Civale, Y, Tezcan, D S, Philipsen, H G G, Duval, F F C, Jaenen, P, Travaly, Y, Soussan, P, Swinnen, B, Beyne, E

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Linear and Nonlinear Nanophotonic Devices Based on Silicon-on-Insulator Wire Waveguides by Dumon, Pieter, Priem, Gino, Nunes, Luis Romeu, Bogaerts, Wim, Thourhout, Dries Van, Bienstman, Peter, Liang, Tak Keung, Tsuchiya, Masahiro, Jaenen, Patrick, Beckx, Stephan, Wouters, Johan, Baets, Roel

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Via-middle through-silicon via with integrated airgap to zero TSV-induced stress impact on device performance by Civale, Yann, Van Huylenbroeck, Stefaan, Redolfi, Augusto, Guo, Wei, Gavan, Khashayar Babaei, Jaenen, Patrick, La Manna, Antonio, Beyer, Gerald, Swinnen, Bart, Beyne, Eric

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Through-silicon via technology for three-dimensional integrated circuit manufacturing by Civale, Y., Redolfi, A., Jaenen, P., Kostermans, M., Van Besien, E., Mertens, S., Witters, T., Jourdan, N., Armini, S., El-Mekki, Z., Vandersmissen, K., Philipsen, H., Verdonck, P., Heylen, N., Nolmans, P., Yunlong Li, Croes, K., Beyer, G., Swinnen, B., Beyne, E.

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Silicon nanophotonic wire structures fabricated by 193nm optical lithography by Selvaraja, S.K., Jaenen, P., Beckx, S., Bogaert, W., Dumon, P., Van Thourout, D., Bates, R.

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Basic photonic wire components in silicon-on-insulator by Dumon, P., Roelkens, G., Bogaerts, W., Van Thourhout, D., Wouters, J., Beckx, S., Jaenen, P., Baets, R.

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Time temperature and other process variables in the warm water Intermediate Development Bake by Samarakone, Nandasiri, Jaenen, Patrick, Van den hove, Luc, Thirsk, Mark, Daraktchiev, Ivan

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