Search Results - Jang, Aeni

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  1. 1
    The Extremely Large 2.5D Molded Interposer on Substrate (MIoS) Package Integration - Warpage and Reliability

    The Extremely Large 2.5D Molded Interposer on Substrate (MIoS) Package Integration - Warpage and Reliability by Nam, Soohyun, Kim, Younglyong, Jang, Aeni, Hwang, Inhyo, Park, Sungwoo, Lee, Su-Chang, Kim, Dae-Woo

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  2. 2
    A study on D2W Hybrid Cu bonding Technology for HBM Multi-die Stacking

    A study on D2W Hybrid Cu bonding Technology for HBM Multi-die Stacking by Lee, Hyeonmin, Kim, Jihoon, Kim, Min-Ki, Lee, Wonil, Jang, Aeni, Lee, Hyuekjae, Kim, Dae-Woo

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  3. 3
    Characterization of Die-to-Wafer Hybrid Bonding using Heterogeneous Dielectrics

    Characterization of Die-to-Wafer Hybrid Bonding using Heterogeneous Dielectrics by Kim, Min-Ki, Park, Soojeoung, Jang, Aeni, Lee, Hyuekjae, Baek, Seungduk, Lee, ChungSun, Kim, Ilhwan, Park, Jumyong, Jee, Youngkun, Kang, Un-Byoung, Kim, Dae-Woo

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  4. 4
    A Study on Memory Stack Process by Hybrid Copper Bonding (HCB) Technology

    A Study on Memory Stack Process by Hybrid Copper Bonding (HCB) Technology by Lee, Sanghoon, Jee, Youngkun, Park, Sangcheon, Lee, Soohwan, Hwang, Bohee, Jo, Gyeongjae, Lee, Chungsun, Park, Jumyong, Jang, Aeni, Jung, HyunChul, Kim, Ilhwan, Kang, Dongwoo, Baek, Seungduk, Kim, Dae-Woo, Kang, Unbyung

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