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Search Results - Jang, Keonsoo
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Electrical and mechanical characterization of an anisotropic conductive adhesive with a low melting point solder
by
Eom, Yong-Sung
,
Jang, Keonsoo
,
Moon, Jong-Tae
,
Nam, Jae-Do
,
Kim, Jong-Min
Published in
Microelectronic engineering
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In-situ blends of polypyrrole/poly(3,4-ethylenedioxythiopene) using vapor phase polymerization technique
by
Kim, Dong Ouk
,
Lee, Pyoung-Chan
,
Kang, Soo-Jung
,
Jang, Keonsoo
,
Lee, Jun-Ho
,
Cho, Min Ho
,
Nam, Jae-Do
Published in
Thin solid films
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Modeling and optimization of the chip level program disturbance of 3D NAND Flash memory
by
HyunSeung Yoo
,
EunSeok Choi
,
JungSeok Oh
,
KyoungJin Park
,
SungWook Jung
,
SeHoon Kim
,
KeonSoo Shim
,
HanSoo Joo
,
KwangSun Jeon
,
MoonSik Seo
,
YoonSoo Jang
,
SangBum Lee
,
JuYeab Lee
,
SangHyun Oh
,
GyuSeog Cho
,
SungKye Park
,
SeokKiu Lee
,
SungJoo Hong
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A highly manufacturable integration technology for 27nm 2 and 3bit/cell NAND flash memory
by
Choong-Ho Lee
,
Suk-Kang Sung
,
Donghoon Jang
,
Sehoon Lee
,
Seungwook Choi
,
Jonghyuk Kim
,
Sejun Park
,
Minsung Song
,
Hyun-Chul Baek
,
Eungjin Ahn
,
Jinhyun Shin
,
Kwangshik Shin
,
Kyunghoon Min
,
Sung-Soon Cho
,
Chang-Jin Kang
,
Jungdal Choi
,
Keonsoo Kim
,
Jeong-Hyuk Choi
,
Kang-Deog Suh
,
Tae-Sung Jung
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Conference Proceeding
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Microelectronic Engineering
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Thin Solid Films
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Anisotropic Conductive Adhesive
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Band-To-Band Tunneling
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Boosting
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Channel Boosting Level
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Chip Operation
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Backfile Package - Materials Science [Yms]
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