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Construction of 3D solder paste surfaces using multi-projection images
by
Kuo, Chung-Hsien
,
Yang, Fang-Chung
,
Wing, Jein-Jong
,
Yang, Ching-Kun
Published in
International journal of advanced manufacturing technology
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Reconstructing the 3D solder paste surface model using image processing and artificial neural network
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YANG, Fang-Chung
,
KUO, Chung-Hsien
,
WING, Jein-Jong
,
YANG, Ching-Kun
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Development of route oriented Petri net for cycle time evaluations in SMT assemblies industries
by
Chung-Hsien Kuo
,
Jein-Jong Wing
,
Eric Lee
,
MuDer Jeng
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Production modeling and simulation of surface mounting technology assembly industries using distributed agent oriented Petri net
by
Chung-Hsien Kuo
,
Jein-Jong Wing
,
MuDer Jeng
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International Journal Of Advanced Manufacturing Technology
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Printed Circuits
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Sliding Mode Control
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Solder Paste Inspection
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