Heterogeneous and Chiplet Integration Using Organic Interposer (CoWoS-R) by Jeng, Shin-Puu, Liu, Monsen

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3D Heterogeneous Integration with Multiple Stacking Fan-Out Package by Feng-Cheng Hsu, Lin, Jackson, Shuo-Mao Chen, Po-Yao Lin, Fang, Jerry, Jin-Hua Wang, Shin-Puu Jeng

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Warpage Modeling and Characterization of the Viscoelastic Relaxation for Cured Molding Process in Fan-Out Packages by Shu-Shen Yeh, Po-Yao Lin, Kuang-Chun Lee, Jin-Hua Wang, Wen-Yi Lin, Ming-Chih Yew, Po-Chen Lai, Shyue-Ter Leu, Shin-Puu Jeng

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Reliability evaluation of a CoWoS-enabled 3D IC package by Banijamali, Bahareh, Chien-Chia Chiu, Cheng-Chieh Hsieh, Tsung-Shu Lin, Hu, Clark, Shang-Yun Hou, Ramalingam, Suresh, Shin-Puu Jeng, Madden, Liam, Yu, Doug C. H.

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An Integrated Warpage Prediction Model Based on Chemical Shrinkage and Viscoelasticity for Molded Underfill by Shu-Shen Yeh, Po-Yao Lin, Kuang-Chun Lee, Jin-Hua Wang, Wen-Yi Lin, Ming-Chih Yew, Po-Chen Lai, Chia-Kuei Hsu, Che-Chia Yang, Shin-Puu Jeng

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High-performance integrated fan-out wafer level packaging (InFO-WLP): Technology and system integration by Liu, C. C., Shuo-Mao Chen, Feng-Wei Kuo, Huan-Neng Chen, En-Hsiang Yeh, Cheng-Chieh Hsieh, Li-Hsien Huang, Ming-Yen Chiu, Yeh, J., Tsung-Shu Lin, Tzu-Jin Yeh, Shang-Yun Hou, Jui-Pin Hung, Jing-Cheng Lin, Chewn-Pu Jou, Chuei-Tang Wang, Shin-Puu Jeng, Yu, D. C. H.

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Organic Interposer CoWoS-R+ (plus) Technology by Lin, M.L., Liu, M.S., Chen, H.W., Chen, S.M., Yew, M.C., Chen, C.S., Jeng, Shin-Puu

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Fan-out wafer molding process optimization using cure-dependent viscoelastic modeling and characterizations by Shu-Shen Yeh, Po-Yao Lin, Kuang-Chun Lee, Jin-Hua Wang, Wen-Yi Lin, Ming-Chih Yew, Po-Chen Lai, Chia-Kuei Hsu, Che-Chia Yang, Shin-Puu Jeng

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Interfacial Strength Characterization and Simulation of the Stacked Copper-Polymer Structures in Fan-out Packages by Chia-Kuei Hsu, Po-Yao Lin, Wen-Yi Lin, Ming-Chih Yew, Shu-Shen Yeh, Kuang-Chun Lee, Jin-Hua Wang, Po-Chen Lai, Che-Chia Yang, Shin-Puu Jeng

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Lidded FCCSP warpage evaluation: Process modeling and characterization of the effect of viscoelasticity and cured shrinkage for molded underfill by Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng, Wen-Yi Lin, Ming-Chih Yew, Kuang-Chun Lee, Jin-Hua Wang, Po-Chen Lai, Shyue-Ter Leu

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Multilayer RDL Interposer for Heterogeneous Device and Module Integration by Lin, Yi-Hang, Yew, M.C., Chen, S.M., Liu, M.S., Kavle, Pravin, Lai, T.M., Yu, C.T., Hsu, F.C., Chen, C.S., Fang, T.J., Hsu, C.K., Lee, K.C., Lin, C.H., Lin, P.Y., Jeng, Shin-Puu

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Characterization methodologies for copper/polymer interfacial strength by Chia-Kuei Hsu, Po-Yao Lin, Wen-Yi Lin, Ming-Chih Yew, Shu-Shen Yeh, Kuang-Chun Lee, Jin-Hua Wang, Po-Chen Lai, Che-Chia Yang, Shin-Puu Jeng

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Next Generation Large Size High Interconnect Density CoWoS-R Package by Lee, Chien-Hsun, Hu, YH, Chen, SM, Lai, CL, Liu, M, Chen, HY, Lin, J, Yew, MC, Hsu, CK, Chiu, MY, Chen, CH, Chou, MW, Chen, WC, Chang, J, Hsieh, C.C., Chen, CS, Chen, HW, Wang, CT, Yan, Kathy, Jeng, Shin-Puu, He, Jun

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Reliability Performance of Advanced Organic Interposer (CoWoS®-R) Packages by Lin, Po-Yao, Yew, M. C., Yeh, S. S., Chen, S. M., Lin, C. H., Chen, C. S., Hsieh, C. C., Lu, Y. J., Chuang, P. Y., Cheng, H. K., Jeng, Shin-Puu

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Fracture Modeling and Characterization of Underfill/Polymer Interfacial Adhesion in RDL Interposer Package by Yeh, Shu-Shen, Lin, P. Y., Hsu, C. K., Lin, Y. S., Wang, J. H., Lai, P. C., Chen, C. H., Lee, Y. C., Yew, M. C., Cheng, S. K., Jeng, Shin-Puu

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The impact of scaling on metal thickness for advanced back end of line interconnects by Chen, Hsueh-Chung, Fan, Su-Chen, Lin, Jian-Hong, Cheng, Yi-Lung, Jeng, Shin-Puu, Wu, Chii-Ming

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Hybrid Fan-out Package for Vertical Heterogeneous Integration by Chuang, Po-Yao, Lin, M.-L., Hung, S.-T., Wu, Y.-W., Wong, D.-C., Yew, M.-C., Hsu, C.-K., Liao, L.-L, Lai, P.-Y., Tsai, P.-H., Chen, S.-M., Cheng, S.-K., Jeng, Shin-Puu

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Analysis of Underfill-Polymer Interfacial Adhesive Strength by Combined Experimental and Modeling Approaches by Yeh, Shu-Shen, Lin, P. Y., Hsu, C. K., Lin, Y. S., Wang, J. H., Lai, P. C., Liao, L. L., Lee, T. Y., Chen, C. H., Yew, M. C., Cheng, S. K., Jeng, Shin-Puu

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Ultra-Thin Package Board Level Drop Impact Modeling and Validation by Yeh, Shu-Shen, Lin, P. Y., Yew, M. C., Lin, W. Y., Lee, K. C., Yang, C. C., Wang, J. H., Lai, P. C., Hsu, C. K., Jeng, Shin-Puu

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Viscoelastic Modeling for Heterogeneous Fan-out Wafer Molding Process by Yeh, Shu-Shen, Lin, P. Y., Lee, K. C., Yew, M. C., Yang, C. C., Wang, J. H., Hsu, C. K., Lai, P. C., Tseng, Dion, Cheng, S. K., Jeng, Shin-Puu

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