Search Results - Jeon, Choongpyo

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  1. 1
    Investigation of Acceleration factors for SnAgCu-Bi Solder Joints under various temperature cycling test conditions

    Investigation of Acceleration factors for SnAgCu-Bi Solder Joints under various temperature cycling test conditions by Jeon, Choongpyo, Choi, Youngsung, Jeong, Hyunsik, Seo, Kwangwon, Rhew, Keunho, Bae, Jinsoo, Hwang, Yuchul

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  2. 2
    Investigation of Reflow Effect and Empirical Lifetime Modeling on the Board Level Solder Joint Reliability

    Investigation of Reflow Effect and Empirical Lifetime Modeling on the Board Level Solder Joint Reliability by Seo, Kwangwon, Rhew, Keunho, Jeon, Choongpyo, Choi, Youngsung, Bae, Jinsoo, Hwang, Yuchul, Kim, Hoosung, Pae, Sangwoo

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    A Systematic Study and Lifetime Modeling on the Board Level Reliability of SSD after Temperature Cycling Test

    A Systematic Study and Lifetime Modeling on the Board Level Reliability of SSD after Temperature Cycling Test by Jeon, Choongpyo, Choi, Youngsung, Rhew, Keunho, Bae, Jinsoo, Cho, Yeungjung, Pae, Sangwoo

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