Search Results - Jhih-Jyun Yan

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  1. 1
    Effects of organic acids on through-hole filling by copper electroplating

    Effects of organic acids on through-hole filling by copper electroplating by Yan, Jhih-Jyun, Chang, Liang-Chun, Lu, Chun-Wei, Dow, Wei-Ping

    Published in Electrochimica acta
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  2. 2
    Characterization of Through-Hole Filling by Copper Electroplating Using a Tetrazolium Salt Inhibitor

    Characterization of Through-Hole Filling by Copper Electroplating Using a Tetrazolium Salt Inhibitor by Lin, Guan-Ye, Yan, Jhih-Jyun, Yen, Ming-Yao, Dow, Wei-Ping, Huang, Su-Mei

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  3. 3
    Through-Hole Filling by Copper Electroplating Using a Single Organic Additive

    Through-Hole Filling by Copper Electroplating Using a Single Organic Additive by Dow, Wei-Ping, Liu, De-Huei, Lu, Chun-Wei, Chen, Chien-Hung, Yan, Jhih-Jyun, Huang, Su-Mei

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  4. 4
    A novel copper plating formula for through silicon holes filling in a center-up mode

    A novel copper plating formula for through silicon holes filling in a center-up mode by Chun-Wei Lu, Jhih-Jyun Yan, Wei-Ping Dow, Jing-Yuan Lin

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  5. 5
    The effect of acid on fast through-hole filling by Cu electroplating

    The effect of acid on fast through-hole filling by Cu electroplating by Jhih-Jyun Yan, Liang-Chun Chang, Chun-Wei Lu, Wei-Ping Dow, An-Hong Liu, Wang, D. W.

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