Search Results - Ji, Lian-Nan

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  1. 1
    Machine-vision-based intelligent robotic replacement system of grinding-wheel-saws for steel round bar sawing machine

    Machine-vision-based intelligent robotic replacement system of grinding-wheel-saws for steel round bar sawing machine by Pan, Jian-Zhou, Yang, Chi-Hsin, Wu, Long, Qiu, Sijie, Ji, Lian-Nan, Wang, Kun-Chieh

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  2. 2
    Sodium pheophorbide a controls cherry tomato gray mold (Botrytis cinerea) by destroying fungal cell structure and enhancing disease resistance-related enzyme activities in fruit

    Sodium pheophorbide a controls cherry tomato gray mold (Botrytis cinerea) by destroying fungal cell structure and enhancing disease resistance-related enzyme activities in fruit by Ji, Jing-Yu, Yang, Jing, Zhang, Bo-Wen, Wang, Shu-Ren, Zhang, Guo-Cai, Lin, Lian-Nan

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  3. 3
    Key factors affecting photoactivated fungicidal activity of sodium pheophorbide a against Pestalotiopsis neglecta

    Key factors affecting photoactivated fungicidal activity of sodium pheophorbide a against Pestalotiopsis neglecta by Yang, Jing, Zhang, Bo-Wen, Lin, Lian-Nan, Zan, Xiao-Li, Zhang, Guo-Cai, Chen, Guang-Sheng, Ji, Jing-Yu, Ma, Wei-Hu

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  4. 4
    Common Source Line-to-Word Line Short Improvement by Eliminating SLT Sidewall Notch in 3D NAND Deep Trench Patterning

    Common Source Line-to-Word Line Short Improvement by Eliminating SLT Sidewall Notch in 3D NAND Deep Trench Patterning by Chung, Yao-An, Chu, Yuan-Chieh, Chang, Chih-Chin, Lee, Hong-Ji, Lian, Nan-Tzu, Yang, Tahone, Chen, Kuang-Chao, Lu, Chih-Yuan

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  5. 5
    Periconones B-E,new meroterpenoids from endophytic fungus Periconia sp

    Periconones B-E,new meroterpenoids from endophytic fungus Periconia sp by Liu, Ji-Mei, Zhang, De-Wu, Zhang, Min, Chen, Ri-Dao, Yan, Zheng, Zhao, Jian-Yuan, Zhao, Jin-Lian, Wang, Nan, Dai, Jun-Gui

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  6. 6
    Post-Etch Yield Killer Defects in 3D NAND High Aspect Ratio Etching Process

    Post-Etch Yield Killer Defects in 3D NAND High Aspect Ratio Etching Process by Chang, Chih-Chin, Hsiao, Ching-Hung, Chen, Yi-Che, Wang, Ching-Hung, Chung, Yao-An, Wang, Li-Wei, Lee, Hong-Ji, Lian, Nan-Tzu, Lee, Shih-Chin, Han, Tzung-Ting, Yang, Tahone, Chen, Kuang-Chao, Lu, Chih-Yuan

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  7. 7
    Impact of Asymmetric Memory Hole Profile on Silicon Selective Epitaxial Growth in 3D NAND Memory : AEPM: Advanced Equipment Processes and Materials

    Impact of Asymmetric Memory Hole Profile on Silicon Selective Epitaxial Growth in 3D NAND Memory : AEPM: Advanced Equipment Processes and Materials by Chang, Yao-Yuan, Yang, Zusing, Wu, Ming-Tsung, Lee, Hong-Ji, Lian, Nan-Tzu, Yang, Tahone, Chen, Kuang-Chao, Lu, Chih-Yuan

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  8. 8
    Oval-Shaped OP-Layer Hole Etching: Shape Deformation, Local Arcing, and Hole Bridging Improvements

    Oval-Shaped OP-Layer Hole Etching: Shape Deformation, Local Arcing, and Hole Bridging Improvements by Yang, Zusing, Chang, Yao-Yuan, Wu, Ming-Tsung, Lee, Hong-Ji, Lian, Nan-Tzu, Yang, Tahone, Chen, Kuang-Chao, Lu, Chih-Yuan

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  9. 9
    Width Walk Control in 3D NAND Staircase Structure Etching

    Width Walk Control in 3D NAND Staircase Structure Etching by Hsiao, Ching-Hung, Cheng, Chen-Yu, Lee, Hong-Ji, Lian, Nan-Tzu, Han, Tzung-Ting, Yang, Tahone, Chen, Kuang-Chao, Lu, Chih-Yuan

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  10. 10
    A Case of Plasma-Induced Film Breakdown in 3D NAND BEOL Dielectric Etch

    A Case of Plasma-Induced Film Breakdown in 3D NAND BEOL Dielectric Etch by Liang, Ying-Hung, Chiu, Yuan-Chieh, Yang, Zusing, Lee, Hong-Ji, Lian, Nan-Tzu, Yang, Tahone, Chen, Kuang-Chao, Lu, Chih-Yuan

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  11. 11
    Study of Plasma Arcing Mechanism in High Aspect Ratio Slit Trench Etching

    Study of Plasma Arcing Mechanism in High Aspect Ratio Slit Trench Etching by Chung, Yao-An, Lung, Cheng-Yi, Chiu, Yuan-Chieh, Lee, Hong-Ji, Lian, Nan-Tzu, Yang, Tahone, Chen, Kuang-Chao, Lu, Chih-Yuan

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  12. 12
    The Constraint Artificial-Intelligence Assisted Method for Etching Structure Optimization

    The Constraint Artificial-Intelligence Assisted Method for Etching Structure Optimization by Yang, Zusing, Liang, Ying-Hung, Tsai, Cheng-En, Wu, Ming-Tsung, Chiu, Yuan-Chieh, Lee, Hong-Ji, Lian, Nan-Tzu, Yang, Tahone, Chen, Kuang-Chao, Lu, Chih-Yuan

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  13. 13
    Pre-Epitaxial Plasma Etch Treatment for the Selective Epitaxial Growth of Silicon in High Aspect Ratio 3D NAND Memory

    Pre-Epitaxial Plasma Etch Treatment for the Selective Epitaxial Growth of Silicon in High Aspect Ratio 3D NAND Memory by Lung, Cheng-Yi, Chung, Yao-An, Wu, Ming-Tsung, Lee, Hong-Ji, Lian, Nan-Tzu, Yang, Tahone, Chen, Kuang-Chao, Lu, Chih-Yuan

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  14. 14
    Pattern dependent plasma charging effect in high aspect ratio 3D NAND architecture

    Pattern dependent plasma charging effect in high aspect ratio 3D NAND architecture by Yang, Zusing, Chung, Yao-An, Chang, Sheng-Yuan, Lee, Hong-Ji, Lian, Nan-Tzu, Yang, Tahone, Chen, Kuang-Chao, Lu, Chih Yuan

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  15. 15
    Asymmetric etching profile control during high aspect ratio Plasma etch

    Asymmetric etching profile control during high aspect ratio Plasma etch by Yang, Zusing, Wu, Li-Ian, Chang, Sheng-Yuan, Chiu, Yuan-Chieh, Lee, Hong-Ji, Lian, Nan-Tzu, Yang, Tahone, Chen, Kuang-Chao, Lu, Chih-Yuan, Watanabe, Hayato, Cheng, Yinhwa, Arase, Takao, Mori, Masahito

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  16. 16
    Study of Ti/TiN bump defect formation mechanism and elimination by etch process optimization

    Study of Ti/TiN bump defect formation mechanism and elimination by etch process optimization by Wu, Li-Lan, Chiu, Yuan-Chieh, Yang, Zusing, Chang, Sheng-Yuan, Lee, Hong-Ji, Lian, Nan-Tzu, Yang, Tahone, Chen, Kuang-Chao, Lu, Chih-Yuan

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  17. 17
    Investigation of shape etching on multi-layer SiO2/poly-Si for 3D NAND architecture

    Investigation of shape etching on multi-layer SiO2/poly-Si for 3D NAND architecture by Zusing Yang, Fang-Hao Hsu, Lo Yueh Lin, Hong-Ji Lee, Nan-Tzu Lian, Tahone Yang, Kuang-Chao Chen, Chih-Yuan Lu

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  18. 18
    Novel hybrid 3D NAND flash memory containing vertical-gate and gate-all-around structures

    Novel hybrid 3D NAND flash memory containing vertical-gate and gate-all-around structures by Chung, Yao-An, Yang, Zusing, Chiu, Yuan-Chieh, Hong, Shih-Ping, Lee, Hong-Ji, Lian, Nan-Tzu, Yang, Tahone, Chen, Kuang-Chao, Lu, Chih-Yuan

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  19. 19
    Wafer topology effect on the etching saturation behaviors in NF3/NH3 remote plasmas

    Wafer topology effect on the etching saturation behaviors in NF3/NH3 remote plasmas by Kuo-Feng Lo, Fang-Hao Hsu, Xin-Guan Lin, Hong-Ji Lee, Nan-Tzu Lian, Tahone Yang, Kuang-Chao Chen

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  20. 20
    A case study on severe yield loss caused by wafer arcing in BEOL manufacturing

    A case study on severe yield loss caused by wafer arcing in BEOL manufacturing by Hong-Ji Lee, Hsu-Sheng Yu, Shih-Chin Lee, Chih-Kai Yang, Shao-En Chang, Kuo-Feng Lo, Xin-Guan Lin, Nan-Tzu Lian, Tahone Yang, Kuang-Chao Chen

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